Double-Sided Interconnect Die Stacking With Shorter Die-to-Die Links

The patent extracts and eliminates the additional interconnecting elements (interposer, bridge die, TSV structures) from the conventional stacking architecture. By using double-sided interconnect layers directly on each die, the intermediate connection elements are removed entirely, simplifying the overall structure while maintaining connection reliability through direct die-to-die bonding.

The patent merges the interconnection function into the die structure itself by forming interconnect layers on both front and back surfaces of each die. This integration eliminates the need for separate interconnecting elements, as each die becomes self-sufficient for both computation and interconnection purposes.

The patent removes the expensive additional interconnecting elements (interposer, bridge die) from the manufacturing process. By using only the essential die structures with double-sided interconnect layers, material costs and manufacturing steps are reduced while maintaining connection reliability.

The patent replaces expensive, complex interconnecting elements with simpler, more cost-effective die structures that achieve the same interconnection function through double-sided interconnect layers, reducing overall manufacturing cost.

The patent extracts and removes the intermediate interconnecting elements that physically extend the interconnect path. By enabling direct die-to-die bonding through double-sided interconnect layers, the physical distance signals must travel is minimized to just the bonding interface between adjacent dies.

Instead of extending connections outward through intermediate elements, the patent inverts the approach by bringing connections directly together at the die bonding interface, effectively shortening the interconnect path to the minimum possible length.