Double-Sided Local Interconnect Packaging Without Solder Joints
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Solution Overview
Problem
The semiconductor industry faces challenges in achieving high integration density and reliable electrical connections in semiconductor packages due to warpage mismatch and electromigration issues, particularly in Package-on-Package (PoP) technology, where traditional solder joints are prone to failure.
Innovation Solution
A semiconductor package design featuring a double-sided local interconnect component embedded in a redistribution structure, eliminating the need for adhesives like die attach films, which allows for solder-free connections and reduces warpage mismatch by using a solder-free connection between the embedded double-sided local interconnect component and the redistribution structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional solder joints are used in Package-on-Package technology, then electrical connections can be established, but warpage mismatch and electromigration issues occur leading to connection failure
Solution Approach 1:
The patent extracts and eliminates the solder joint from the connection system by implementing a direct bonding interface between the local interconnect component and the substrate. This removal of the solder joint eliminates the source of warpage mismatch and electromigration issues while maintaining electrical connectivity through alternative bonding methods.
Solution Approach 2:
The patent introduces a local interconnect component as an intermediary element that provides a bonding interface between the semiconductor die and the substrate. This intermediary component enables direct bonding without requiring solder joints, thereby resolving the warpage and electromigration problems while maintaining electrical connection functionality.
2Ease of manufacture
If adhesives like die attach films are used to attach local interconnect components, then components can be assembled, but the design complexity and potential reliability issues increase
Solution Approach 1:
The patent extracts and eliminates the adhesive layer from the assembly by designing a direct bonding interface between the local interconnect component and the substrate. This removal simplifies the overall package structure and eliminates potential reliability issues associated with adhesives while maintaining the assembly functionality.
3Reliability
If solder-free connections are implemented, then electromigration issues are reduced and reliability increases, but manufacturing precision requirements increase
Solution Approach 1:
The patent applies preliminary action by pre-forming the bonding interface features on the local interconnect component and substrate before the bonding process. This includes preparing the surfaces and positioning features in advance, which facilitates precise alignment and bonding without requiring extremely tight tolerances during the actual bonding process, thereby reducing the overall manufacturing precision requirements.
Data Source
AI summary
A method of forming a semiconductor device includes attaching a first local interconnect component to a first substrate with a first adhesive, forming a first redistribution structure over a first side of the first local interconnect component, and removing the first local interconnect component and the first redistribution structure from the first substrate and attaching the first redistribution structure to a second substrate. The method further includes removing the first adhesive from the first local interconnect component and forming an interconnect structure over a second side of the first local interconnect component and the first encapsulant, the second side being opposite the first side. A first conductive feature of the interconnect structure is physically and electrically coupled to a second conductive feature of the first local interconnect component.