Double-Sided Laser Diode Cooling with Isolated Mounting Pads
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
High-powered semiconductor laser diodes face limitations in heat dissipation, leading to increased temperature and reduced reliability, and double-sided cooling poses challenges in electrical contact accessibility and potential damage during mounting.
Innovation Solution
The implementation of a double-sided cooling system using two heat sinks with electrically isolated mounting pads and contact bars, allowing for tailored electrical contacting and efficient heat transfer through integrated coolant passages and insulating layers, while maintaining electrical isolation and reducing the risk of electro-corrosion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If double-sided cooling is implemented with two heat sinks, then heat dissipation efficiency is improved, but electrical contact accessibility deteriorates
Solution Approach 1:
The electrical contact function is segmented from the heat sink structure through separate contact bars. The contact bars extend beyond the heat sink edges, providing accessible electrical contact points without interfering with the dual heat sink cooling configuration. This segmentation allows independent optimization of cooling and electrical contact functions.
2Reliability
If mounting pads are made electrically isolated, then electro-corrosion resistance is improved, but manufacturing complexity increases
Solution Approach 1:
An electrical insulating layer is introduced as an intermediary between the mounting pads and the heat sink substrate. This insulating layer electrically isolates the mounting pads from each other and from the heat sink, preventing electro-corrosion while allowing the mounting pads to be formed using standard metallization processes on the heat sink surface.
3Ease of operation
If contact bars extend beyond heat sink edges, then electrical contact accessibility is improved, but device footprint increases
Solution Approach 1:
The contact bars are designed with local quality differentiation: they extend beyond the heat sink edges only at the regions where electrical contact is needed, while maintaining compact integration with the heat sink structure elsewhere. This allows selective extension of contact bars to provide accessible electrical contacts without unnecessarily increasing the overall device footprint.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the optical output power and stability of laser diodes by effective heat management, reducing packaging costs and enabling serial connection of diode segments with improved reliability and efficiency.
Implementation Method 1
a first heat sink including a first mounting layer... a second heat sink including a second mounting layer... efficient heat transfer through integrated coolant passages
Implementation Method 2
a first main body portion including at least one fluid channel; a second main body portion including at least one fluid channel
Implementation Method 3
a first electrical insulating layer on the first main body portion; a second electrical insulating layer on the second main body portion... maintaining electrical isolation
Data Source
AI summary
A laser diode device includes: a first heat sink including a first mounting layer, in which the first mounting layer includes at least two mounting pads electrically isolated from one another; a second heat sink including a second mounting layer, in which the second mounting layer includes at least two mounting pads electrically isolated from one another; and a laser diode bar between the first heat sink and the second heat sink, in which a bottom electrical contact of the laser diode bar is mounted to the first mounting layer, and a top electrical contact of the laser diode bar is mounted to the second mounting layer.