Double-Sided LED Pixel Package Structure Without Wire Bonding
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Solution Overview
Problem
Existing LED packaging methods are inefficient for multiple chips, leading to increased thickness, weight, and cost in double-sided display devices due to wire bonding, which hinders applications requiring light, thin, and small form factors, and the assembly of double-sided displays results in thicker and heavier products.
Innovation Solution
A double-sided display pixel package structure with a transparent substrate, conduction bumps, dummy diode structures, light-emitting diode structures, protection layers, and a half mirror film, along with a specific layer composition and fabrication method that includes forming conduction layers and half mirror films to simplify the structure and reduce thickness and weight.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If wire bonding is used to connect LED electrodes to package substrate, then electrical connection is achieved, but production speed decreases and structure volume increases
Solution Approach 1:
The patent merges multiple separate packaging processes into a single integrated package structure. Multiple LED chips are mounted on both front and back surfaces of the same package substrate, with all chips sharing common cathode and anode connections through the substrate thickness. This eliminates the need for separate wire bonding operations for each chip, significantly improving production speed while reducing overall structure volume.
Solution Approach 2:
The patent transitions from a traditional single-sided packaging approach to a three-dimensional dual-sided mounting structure. LED chips are arranged on both the front surface and back surface of the package substrate, utilizing the Z-dimension (thickness direction) for electrical connections through conductive vias. This spatial reorganization enables parallel processing and reduces the horizontal footprint of the device.
2Adaptability or versatility
If two independent single-sided display devices are assembled back-to-back to create double-sided display, then double-sided display function is achieved, but overall thickness and weight increase
Solution Approach 1:
The patent combines two display functions into a single integrated package by mounting LED chips on both the front and back surfaces of one package substrate. The front surface contains display chips while the back surface contains non-display chips, both sharing the same package structure and electrical connections. This eliminates the need for assembling two separate devices back-to-back, reducing overall thickness while achieving double-sided display functionality.
Solution Approach 2:
The package substrate serves multiple functions simultaneously: it acts as the mounting platform for both front and back surface chips, provides electrical connections through conductive vias, offers mechanical support, and enables both display and non-display functions within a single structure. This multi-functionality reduces the need for additional components and assembly steps.
3Adaptability or versatility
If two independent single-sided display devices are assembled back-to-back, then double-sided display is achieved, but cost increases
Solution Approach 1:
The patent consolidates two separate device packages into one integrated structure, allowing simultaneous mounting and wiring of multiple chips during a single packaging process. This reduces the total number of assembly operations, eliminates the need for two separate package substrates, and lowers overall manufacturing cost while maintaining double-sided display functionality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution simplifies the structure, reduces thickness and weight, and lowers costs by enabling efficient electrical connections and reflective properties, suitable for diverse electronic product designs.
Implementation Method 1
a half mirror film, formed on sidewalls of the transparent substrate, the first protection layer, the conduction layer, and the second protection layer and the partial top of the second protection layer
Data Source
AI summary
The disclosure describes a double-sided display pixel package structure and a method for fabricating the same. The double-sided display pixel package structure includes a transparent substrate, conduction bumps, a dummy diode structure, light-emitting diode (LED) structures, a first protection layer, a conduction layer, a second protection layer, and a half mirror film. The transparent substrate is penetrated with conduction vias. The conduction bumps are respectively formed on the conduction vias. The dummy diode structure and the LED structures are respectively formed on the conduction bumps. The first protection layer, formed on the transparent substrate, surrounds the conduction bumps, the dummy diode structure, and the LED structures. The conduction layer and the second protection layer are sequentially formed on the first protection layer, the dummy diode structure, and the LED structures. The half mirror film is formed on the substrate, the protection layers, and the conduction layer.