Double-Sided High-Power Module Layout for Smaller PCB Footprint
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Solution Overview
Problem
Existing wireless transceiver components have a large footprint in the x-y plane, which conflicts with the pressure to reduce component size.
Innovation Solution
A double-sided high-power module design is implemented, where a high-power die is positioned on one side of a metallization layer and other components are placed on the opposite side within a mold material, with conductors extending through the mold to external contact points, allowing electrical coupling to a substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If components are arranged on a single side of the metallization layer, then ease of manufacture is improved, but the area occupied by the module increases
Solution Approach 1:
The patent transitions from a single-sided component arrangement to a double-sided configuration, utilizing the z-dimension (vertical stacking) to reduce the x-y plane footprint. Components are distributed across both sides of the metallization layer, effectively converting a 2D layout problem into a 3D spatial arrangement that minimizes planar area occupation.
Solution Approach 2:
The module is segmented into two distinct sides with different component types: high-power dies on one side requiring air cavities, and passive components on the other side embedded in mold compound. This segmentation allows each side to be optimized independently for its specific functional requirements while collectively reducing the overall module footprint.
2Power
If high-power dies are positioned in an air cavity, then power handling capability is improved, but the manufacturing complexity increases
Solution Approach 1:
The air cavity structure is pre-formed in the substrate before die attachment, and the high-power dies are pre-positioned within these cavities. The mold compound is then applied to encapsulate only the necessary components on the opposite side, leaving the air cavities intact for thermal management. This preliminary structuring simplifies subsequent assembly steps despite the initial complexity of forming air cavities.
Solution Approach 2:
The air cavity configuration is applied locally only to high-power dies that require enhanced thermal management, while other passive components are embedded in solid mold compound. This localized application of air cavities provides thermal benefits where needed without unnecessarily complicating the manufacturing of the entire module structure.
3Area of stationary object
If components are placed on both sides of the metallization layer, then the area occupied is reduced, but device complexity increases
Solution Approach 1:
The patent utilizes the vertical dimension (z-axis) by stacking components on both sides of the metallization layer, effectively transitioning from a planar 2D layout to a three-dimensional arrangement. This dimensional transition reduces the footprint area by exploiting the third dimension for component placement, with conductors extending vertically through the mold compound to connect corresponding elements on opposite sides.
Data Source
AI summary
Double-sided high-power modules with air cavities are disclosed. In one aspect, a module may have a metallization layer having a high-power die on a first side and other components encased in mold material on a second side opposite the first side. Conductors are provided that couple metal conductors in the metallization layer through the mold to an external surface of the mold material such that the module may be electrically coupled to a substrate such as a printed circuit board or the like. By placing components on both sides of the metallization layer, the overall x-y dimensions of the module may be reduced.