Double-Sided Heat Dissipation Module With Guide Stack Alignment
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Solution Overview
Problem
Semiconductor modules with double-sided heat dissipation structures face challenges due to thickness deviations between semiconductor devices and heat dissipation substrates, leading to poor adhesion and difficult process control during manufacturing.
Innovation Solution
A semiconductor module design featuring a guide stack with opening areas for mounting semiconductor dies between first and second heat dissipation substrates, allowing for easier alignment and improved flatness, and a manufacturing method that couples the semiconductor dies to the guide assembly and heat dissipation substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If semiconductor devices are individually mounted on heat dissipation substrates to achieve double-sided heat dissipation, then heat dissipation effectiveness is improved, but thickness deviation occurs between the semiconductor device and the heat dissipation substrate
Solution Approach 1:
The patent introduces a guide assembly as an intermediary component between the semiconductor device and the heat dissipation substrate. This guide assembly includes a guide stack with a recess that receives the semiconductor device, and a support structure that provides mechanical support. The intermediary guide assembly acts as a buffer to accommodate thickness variations, allowing the semiconductor device to be properly positioned and adhered to the heat dissipation substrate without direct contact, thereby resolving the thickness deviation problem while maintaining effective heat dissipation.
2Temperature
If semiconductor devices are individually mounted on heat dissipation substrates, then heat dissipation to both top and bottom is achieved, but adhesion between the semiconductor device and the heat dissipation substrate becomes poor
Solution Approach 1:
The guide assembly serves as a mediator that improves adhesion by providing a stable mounting platform. The guide stack with its recess securely holds the semiconductor device in place, and the support structure ensures proper mechanical coupling. This intermediary structure distributes the mechanical stress and thermal expansion forces, preventing direct stress concentration at the semiconductor-device-to-substrate interface, thereby enhancing adhesion strength while maintaining the double-sided heat dissipation capability.
3Temperature
If individual mounting of semiconductor devices is performed, then heat dissipation structure is achieved, but process control during manufacturing becomes difficult
Solution Approach 1:
The guide assembly acts as a standardized intermediary component that simplifies the manufacturing process. By pre-fabricating the guide stack with precise recess dimensions and integrating the support structure, the assembly provides built-in alignment features and mechanical constraints. This standardized intermediary component reduces the complexity of individual device mounting operations, improves repeatability, and enhances process control during manufacturing, while still enabling the double-sided heat dissipation function.
4Manufacturing precision
If guide assembly is introduced to prevent thickness deviation, then manufacturing precision is improved, but device complexity increases
Solution Approach 1:
The guide assembly is segmented into distinct functional components: the guide stack with recess for receiving the semiconductor device, and the support structure for mechanical support. This segmentation allows each component to be optimized independently for its specific function while maintaining overall simplicity. The modular design reduces the complexity burden by allowing standardized manufacturing of separate components that are then assembled, rather than creating a single complex integrated structure.
Solution Approach 2:
The guide assembly is designed as a universal component that can accommodate multiple semiconductor devices with similar dimensions. The guide stack recess and support structure are configured to provide general-purpose mounting capabilities. This multi-functionality reduces device complexity by using a single standardized guide assembly design for multiple devices, rather than creating unique mounting structures for each device, thereby achieving thickness deviation control without proportionally increasing overall system complexity.
Data Source
AI summary
A semiconductor module having a double-sided heat dissipation structure according to one aspect of the present invention, which can secure the gap between the first and second heat dissipation substrates without using existing spacers, includes a first heat dissipation substrate and a second heat dissipation substrate arranged to face each other; a guide stack disposed between the first heat dissipation substrate and the second heat dissipation substrate, and having an opening area for mounting a semiconductor die in a pattern; and a semiconductor die mounted within the opening area.