Double-Sided Heat Dissipation Module Spacer Alignment
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Solution Overview
Problem
Double-sided heat dissipation power semiconductor modules face issues such as miss-alignment, flatness problems due to height deviations, adhesion failures between substrates, and low reliability due to component misalignment and material forms, leading to inefficiencies in heat management and increased costs.
Innovation Solution
A power semiconductor module design featuring a semiconductor die layer with first and second power semiconductor dies surrounded by a mold, with wiring layers on both sides and substrates for heat dissipation, where connection wires penetrate the mold to connect wires electrically, reducing the need for spacers and enhancing alignment and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a double-sided heat dissipation power semiconductor module is used, then heat dissipation efficiency is improved, but miss-alignment between components and flatness problems occur
Solution Approach 1:
The patent introduces a spacer as an intermediary component between the upper and lower substrates. This spacer acts as a mediator that maintains a specific distance between the substrates, thereby preventing miss-alignment and flatness problems while preserving the double-sided heat dissipation capability. The spacer serves as a buffer element that resolves the conflict between heat dissipation performance and manufacturing precision.
2Temperature
If a double-sided heat dissipation power semiconductor module is used, then heat dissipation efficiency is improved, but adhesion failure between substrates occurs
Solution Approach 1:
The spacer serves as a protective intermediary that prevents direct contact between the upper and lower substrates. This eliminates adhesion failure risks by maintaining a controlled gap between the substrates, thereby improving adhesion reliability while preserving the double-sided heat dissipation function.
3Manufacturing precision
If spacers are used to maintain distance between substrates, then alignment precision is improved, but device complexity and material costs increase
Solution Approach 1:
The spacer, while adding a component, provides critical functionality in maintaining alignment precision and preventing adhesion failures. The patent accepts this additional component as necessary to achieve the desired manufacturing precision and reliability, particularly for double-sided heat dissipation modules where substrate distance control is critical.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design improves alignment, flatness, and reliability by reducing the number of heterogeneous junctions and eliminating spacer-related issues, while also reducing material and process costs by eliminating the spacer, thus enhancing heat dissipation efficiency and module performance.
Implementation Method 1
a substrate layer configured to dissipate heat that is delivered from the semiconductor die layer to the wiring layer
Data Source
AI summary
The present disclosure relates to a power semiconductor module of which heat is dissipated by its both sides and provides a power semiconductor module technology in which a mold is formed in a surrounding space of a power semiconductor die, and then, wires are formed on upper and lower sides of the power semiconductor die and substrates are disposed on upper and lower sides of the wires.