Single-Step Double-Sided Molding for Semiconductor Substrates
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Solution Overview
Problem
The existing double-sided molding process for semiconductor devices requires two different molds and significant capital expenditures, making it complex and costly.
Innovation Solution
A single molding step process for double-sided molding is developed, where a mold with internal walls or pillars supports a SIP substrate, allowing encapsulant to flow between the top and bottom sides, and conductive bumps or pillars are used to maintain electrical connections without being fully embedded in the encapsulant, simplifying the process and reducing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a traditional double-sided molding process is used, then both sides of the semiconductor device can be molded, but the process requires two different molds and significant capital expenditures, increasing complexity and cost
Solution Approach 1:
The patent combines two separate molding operations into a single molding step by using a multi-cavity mold that can simultaneously form both the first and second encapsulants. This merging of operations eliminates the need for two different molds and reduces capital expenditures while maintaining the ability to mold both sides of the semiconductor device.
Solution Approach 2:
The molding system is designed with universal capability to perform multiple functions: a single mold structure can produce both the first encapsulant and the second encapsulant with different properties (such as different softness levels) in one operation. This multi-functional approach simplifies the manufacturing process while maintaining flexibility.
2Device complexity
If a single molding step process is used, then manufacturing complexity and cost are reduced, but the encapsulant must flow between top and bottom sides while maintaining electrical connections
Solution Approach 1:
The patent applies local quality by creating regions of different encapsulant properties in specific locations. The first encapsulant is formulated with different softness characteristics than the second encapsulant, allowing each region to be optimized for its specific function: one side for better electrical connection maintenance, the other for different packaging requirements.
Solution Approach 2:
The mold structure is pre-configured with cavities and channels that guide the encapsulant flow in advance. The mold design includes preliminary positioning features that ensure conductive bumps or pillars are properly positioned before the encapsulant is injected, allowing the encapsulant to flow between top and bottom sides while maintaining electrical connections.
Data Source
AI summary
A semiconductor device includes a substrate with an opening formed through the substrate. A first electronic component is disposed over the substrate outside a footprint of the first opening. A second electronic component is disposed over the substrate opposite the first electrical component. A third electronic component is disposed over the substrate adjacent to the first electronic component. The substrate is disposed in a mold including a second opening of the mold over a first side of the substrate. The mold contacts the substrate between the first electronic component and the third electronic component. An encapsulant is deposited into the second opening. The encapsulant flows through the first opening to cover a second side of the substrate. In some embodiments, a mold film is disposed in the mold, and an interconnect structure on the substrate is embedded in the mold film.