Double-Sided Mounting Board Lead Frame Resin Thickness
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Solution Overview
Problem
Existing electronic component configurations, such as those with lead frames on semiconductor integrated circuits, face challenges in reducing size and thickness due to protrusions from insulating resin and uneven contact surfaces, which hinder miniaturization and bonding efficiency.
Innovation Solution
An electronic component module with a double-sided mounting board where components are mounted on both sides and a lead frame bonded to the back surface, allowing the insulating resin to seal only the back surface, ensuring the lead frame is not covered, and the thickness of the resin is less than or equal to the lead frame, enabling vertical overlap of contact surfaces for improved bonding and reduced thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the lead frame protrudes from the side surfaces and lower surface of the insulating resin, then the electronic component can be fixed to the main board, but the size and thickness of the electronic component cannot be reduced
Solution Approach 1:
The patent repositions the lead frame contact surfaces to overlap in the vertical dimension rather than extending horizontally. The first contact surface on the wiring board and the second contact surface on the main board are arranged to overlap when viewed from the vertical direction, eliminating protrusions and reducing the overall thickness of the electronic component while maintaining bonding capability.
2Reliability
If the contact surface of the lead frame extends beyond the outer edge of the wiring board contact surface, then bonding to the main board is achieved, but the size of the electronic device cannot be reduced
Solution Approach 1:
The patent transitions from a horizontal arrangement where lead frame contact surfaces extend beyond the wiring board edges to a vertical arrangement where contact surfaces overlap in the vertical direction. This dimensional reconfiguration reduces the horizontal footprint of the electronic device while preserving the bonding function through vertical stacking of contact surfaces.
3Reliability
If the insulating resin covers the lead frame, then complete sealing of components is achieved, but the thickness and size reduction is hindered
Solution Approach 1:
The patent applies selective sealing where the insulating resin covers the components mounted on the wiring board but deliberately leaves the lead frame contact surfaces exposed. This local differentiation in sealing coverage allows the resin to provide complete sealing for the electronic components while maintaining thin overall thickness by not covering the lead frame extension areas.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for a reduced thickness and size of the electronic component module, enhanced bonding strength, and efficient heat transfer, while preventing noise from component-embedded boards, thus addressing the limitations of existing designs.
Implementation Method 1
an insulating resin sealing the components mounted on the front surface and the back surface
Implementation Method 2
efficient heat transfer
Implementation Method 3
a lead frame bonded to the back surface of the double-sided mounting board
Data Source
AI summary
An electronic component module includes a double-sided mounting board having a front surface and a back surface; components mounted on the front surface and the back surface of the double-sided mounting board; an insulating resin sealing the components mounted on the front surface and the back surface; and a lead frame bonded to the back surface of the double-sided mounting board. The back surface of the double-sided mounting board is sealed with the insulating resin such that the lead frame is not covered by the insulating resin, and the thickness of the insulating resin sealing the components mounted on the back surface of the double-sided mounting board is less than or equal to the thickness of the lead frame.