Double-Sided Electronic Package With Exposed Leadframe Pads
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Solution Overview
Problem
Current package-on-package (PoP) solutions in the market lack flexibility for post-assembly add-on features, limiting customization options for final products, especially for third-party customers who cannot integrate unique device functions into finished electronic packages.
Innovation Solution
A double-sided electronic package design featuring a substrate with leadframe package pad features and molding, allowing package pad features to extend vertically and form electrically conductive paths, enabling post-assembly add-ons and creating a flexible footprint for customization, including vacant attachment sites for additional components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a finished electronic package is purchased from the market, then the package is complete and functional, but the customer cannot add-on unique device functions to create a final product
Solution Approach 1:
The electronic package is divided into modular components: a substrate with leadframe, integrated circuit dies, molding compound, and exposed package pad features. This segmentation allows customers to purchase the base package and add-on unique device functions by attaching additional components to the exposed pad features, enabling customization without requiring complete package redesign.
Solution Approach 2:
The package pad features extend vertically from the substrate surface through the molding compound to the external surface, creating a third dimension for component attachment. This vertical extension allows add-on components to be mounted on the top surface of the package, providing customization capability without increasing the package footprint.
2Adaptability or versatility
If package pad features are extended vertically to enable post-assembly add-ons, then customization flexibility is improved, but manufacturing complexity increases
Solution Approach 1:
The package pad features are formed and extended vertically during the initial package fabrication process, before the package is shipped to customers. The leadframe is attached to the substrate with pad features that protrude through the molding compound, creating pre-configured attachment points that simplify subsequent customer customization while maintaining manufacturing efficiency.
Solution Approach 2:
The package pad features serve multiple functions: they provide electrical connection pathways from internal circuitry to the external surface, structural support for attaching additional components, and standardized mounting points for various customer-specific devices. This multi-functionality reduces the need for separate specialized features, simplifying the overall manufacturing process.
3Adaptability or versatility
If additional components are integrated into the package, then product functionality increases, but assembly yield may decrease
Solution Approach 1:
The package is designed as a modular platform where the base package (substrate, leadframe, molding) is manufactured and tested separately, then customers add their unique device functions. This segmentation allows the base package to be produced with high yield through standardized manufacturing, while customization occurs in a separate post-assembly step that does not impact the core manufacturing yield.
Data Source
AI summary
Embodiments of a double-sided electronic package and methods for fabricating the same are disclosed. In an embodiment, an electronic package comprises: a substrate having a first surface and a second surface; a leadframe having package pad features attached to the first surface of the substrate; a first integrated circuit die attached to the leadframe and electrically coupled to at least one of the package pad features; and molding disposed on the first surface of the substrate between the package pad features, such that the package pad features extend vertically from the first surface of the substrate to a surface of the electronic package, the package pad features forming electrically conductive paths that are exposed on the surface of the electronic package.