Double-Sided Electronic Package Layout for Higher Packaging Density
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Solution Overview
Problem
Conventional semiconductor packages face limitations in space for arranging electronic elements due to the height and width of conductive pillars, restricting the integration of electronic elements of different specifications.
Innovation Solution
A double-sided packaging structure with a carrier structure and circuit structure, where the layout width of the circuit structure is less than the carrier structure, allowing an accommodating space for additional elements, and utilizing support structures and cladding layers for miniaturized layout and increased packaging density.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If the height of conductive pillars is increased to accommodate semiconductor chips with higher height, then the accommodation capability for higher chips is improved, but the width of conductive pillars is increased accordingly, making it difficult to add other electronic elements on the package substrate
Solution Approach 1:
The patent transitions from a single-sided packaging structure to a double-sided packaging structure, utilizing the third dimension (vertical stacking) to accommodate electronic elements. By placing electronic elements on both the first and second sides of the package substrate, the design achieves higher integration density without increasing the planar layout area of conductive pillars, thus resolving the contradiction between pillar height and layout area.
2Adaptability or versatility
If the layout area of conductive pillars is increased to accommodate higher chips, then the accommodation capability is improved, but it becomes difficult to add other electronic elements on the package substrate
Solution Approach 1:
The patent segments the packaging structure into two independent sides (first side and second side), each capable of accommodating electronic elements independently. This segmentation allows different types and specifications of electronic elements to be placed on different sides, increasing adaptability while maintaining a relatively simple layout on each side without requiring excessive conductive pillar area.
3Device complexity
If conventional single-sided packaging is used, then the structure is simple, but the space for arranging electronic elements is limited by the height of conductive pillars
Solution Approach 1:
The patent employs double-sided packaging to utilize the vertical dimension more effectively. By arranging electronic elements on both sides of the package substrate, the available space for arranging elements is doubled without significantly increasing structural complexity, as each side can be designed independently with similar simplicity to conventional single-sided packaging.
Data Source
AI summary
An electronic package is provided, in which a circuit structure is stacked on a carrier structure having a routing layer via support structures, where electronic elements are disposed on upper and lower sides of the circuit structure and the carrier structure, and the electronic elements and the support structures are encapsulated by a cladding layer, such that the electronic package can effectively increase the packaging density to meet the requirements of multi-functional end products.