Double-sided package module shielding via extension portion

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Solution Overview

Problem

Double-sided package modules face complexity in forming effective shielding layers to shield electromagnetic waves, which hinders their integration and performance.

Innovation Solution

A double-sided package module design featuring a substrate with electronic components on both surfaces, sealed by members with integrated shielding layers and a conductive member that connects these layers, forming a continuous circumference along the substrate to enhance shielding efficacy.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If electronic components are mounted on both surfaces of multiple substrates to improve integration, then the degree of integration increases, but the complexity of forming shielding layers increases

Engineering Contradiction:
Improvedegree of integrationVSAvoidcomplexity of forming shielding layers
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The extension portion merges the substrate structure with the shielding layer formation process. By protruding from the lateral surface of the substrate into the space between sealing members, the extension portion allows shielding material to be applied continuously from one side of the substrate, eliminating the need for separate shielding processes on each surface.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The extension portion introduces a new spatial dimension by protruding laterally from the substrate surface. This dimensional change enables the shielding layer to be formed in the space between sealing members, creating a three-dimensional shielding structure that simplifies the overall formation process while maintaining effectiveness.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Object-affected harmful factors

If traditional shielding layer formation methods are used on double-sided substrates, then shielding coverage can be achieved, but the manufacturing process becomes difficult and complex

Engineering Contradiction:
Improveshielding ratioVSAvoidease of forming shielding layers
Core Design Contradiction:
Object-affected harmful factorsVSEase of manufacture

Solution Approach 1:

The extension portion is formed in advance during substrate fabrication, creating a pre-positioned structure that guides subsequent shielding layer formation. This preliminary action ensures that the shielding layer can be applied uniformly without requiring complex alignment or multiple processing steps.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The extension portion acts as an intermediary structure between the substrate and the shielding layer. It provides a bridge that allows shielding material to extend from the substrate surface into the sealing member space, facilitating continuous shielding layer formation while maintaining electrical connection and mechanical stability.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Object-affected harmful factors

If shielding layers are formed on both surfaces of the substrate, then electromagnetic wave shielding is improved, but the manufacturing complexity and process difficulty increase

Engineering Contradiction:
Improveelectromagnetic wave shieldingVSAvoidprocess complexity
Core Design Contradiction:
Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The shielding structure is segmented into distinct components: the extension portion on the substrate, the shielding layer on the sealing members, and the conductive member for electrical connection. This segmentation allows each component to be optimized and manufactured separately, then assembled into a complete shielding system, reducing overall process complexity.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design simplifies the formation of shielding layers, increases the shielding ratio, and ensures reliable electrical contact, effectively blocking electromagnetic interference.

Implementation Method 1

a conductive member continuously formed along a circumference of the extension portion

Methodology Applied
Scientific EffectElectrical conduction: Conduction (electrical)

Implementation Method 2

a first shielding layer positioned on an upper surface and a lateral surface of the first sealing member; a second shielding layer positioned on a lateral surface of the second sealing member

Methodology Applied
Scientific EffectElectromagnetic shielding: Faraday Cage

Data Source

PatentUS10109595B2Double-sided package module and substrate strip
Publication Date: 2018.10.23 SAMSUNG ELECTRO MECHANICS CO LTD
  • US10109595B2 patent drawing
  • US10109595B2 patent drawing
  • US10109595B2 patent drawing

AI summary

A double-sided package module includes a substrate, a first sealing member, a second sealing member, and an extension portion. The substrate includes electronic components positioned on a first surface and a second surface of the substrate. The first sealing member and the second sealing member are positioned on the first surface and the second surface, respectively. The extension portion protrudes from a lateral surface of the substrate into a space between the first sealing member and the second sealing member.