Double-Sided Package Structure Splitting Molded Body
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Solution Overview
Problem
Double-sided packaging techniques are complex and costly due to the need for multiple technical processes, and they often result in substrate warpage, as components are mounted on both sides of a substrate, increasing production time and costs.
Innovation Solution
A manufacturing method that secures discrete double-sided mount structures to a master, molds them simultaneously on both sides, and then splits the molded body to form individual double-sided package structures, reducing the difference in moldflow pressure and alleviating warpage by not sharing a substrate, thus simplifying the process and reducing production difficulties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If components are mounted onto two faces of a substrate to reduce product area, then the utilization rate is improved, but the packaging complexity and production cost are increased
Solution Approach 1:
The substrate is divided into two separate substrates, each carrying components on one face. These two substrates are then packaged independently using a single-sided packaging process, avoiding the complexity of double-sided packaging while achieving high component density through stacked arrangement.
Solution Approach 2:
The packaging structure transitions from a planar double-sided arrangement to a three-dimensional stacked arrangement. Two separately packaged substrates are stacked vertically and connected via through-substrate vias, moving the problem from 2D double-sided packaging to 3D stacked packaging, which simplifies the packaging process while maintaining high integration.
2Area of stationary object
If double-sided packaging is implemented to improve component utilization, then the area utilization is improved, but the production cycle is increased
Solution Approach 1:
The packaging process is segmented into two independent single-sided packaging operations rather than one complex double-sided packaging operation. Each substrate is packaged separately using standardized single-sided processes, which are faster and more成熟, then the packaged substrates are stacked and connected.
Solution Approach 2:
The substrates are prepared and pre-packaged individually before stacking. Electrical connection structures (through-substrate vias) are formed in advance on both substrates, and components are mounted and packaged separately, allowing parallel processing and reducing the overall production cycle compared to sequential double-sided packaging.
3Quantity of substance
If components are mounted on both sides of a substrate, then the component density is improved, but substrate warpage is increased
Solution Approach 1:
The single substrate with components on both sides is segmented into two separate substrates, each with components on one side only. This eliminates the asymmetric stress distribution that causes warpage in double-sided mounted substrates, as each substrate has uniform component distribution on its active face.
Solution Approach 2:
The solution moves from a 2D planar substrate with bidirectional component mounting to a 3D stacked configuration of two unidirectional substrates. This dimensional transition allows each substrate to maintain flatness and stability while achieving high component density through vertical stacking.
Data Source
AI summary
A manufacturing method of a double-sided package structure includes securing at least two discrete double-sided mount structures to a first side of a master at intervals; molding the first side of the master to form a molded body encasing the at least two discrete double-sided mount structures; removing the master; and splitting the molded body to obtain individual double-sided package structures.