Double-Sided PCB Manufacturing via Conductive Paste Printing

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Solution Overview

Problem

Current methods for manufacturing double-sided printed circuit boards are complex, result in significant raw material loss, environmental pollution, and have limitations in forming precise and highly conductive circuit patterns, with issues such as disconnection under heat or physical impact and inadequate adhesive force between conductive paste and substrate.

Innovation Solution

A method involving the preparation of single-sided copper clad laminate, formation of via-holes, printing of conductive paste to form a plated bottom layer, plating of the copper clad surface, and subsequent etching, with optional primer layers to enhance adhesive force, and coverlay formation to protect the circuit pattern.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If traditional etching method is used to form circuit patterns, then fine patterns can be formed, but manufacturing process becomes complicated and raw material loss increases

Engineering Contradiction:

Improvecircuit pattern precisionVSAvoidmanufacturing process complexity

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent replaces the traditional mechanical etching process with a printing method using conductive paste. Instead of mechanically removing material through etching, the conductive paste is printed directly onto the substrate to form circuit patterns, thereby simplifying the manufacturing process while maintaining precision.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent extracts and eliminates unnecessary intermediate steps from the traditional manufacturing process. By using conductive paste printing, the complex multi-step etching process (including mask application, exposure, development, and chemical etching) is reduced to a simpler printing and plating sequence.

Inventive Principle:

Principle #2Taking out (Extraction)

2Reliability

If conductive paste is filled in via-holes to form connection parts, then electrical connection is achieved, but adhesive force is insufficient and disconnection occurs under heat or physical impact

Engineering Contradiction:

Improveconnection reliabilityVSAvoidadhesive force

Core Design Contradiction:

ReliabilityVSStrength

Solution Approach 1:

The patent applies a primer layer to the via-hole surface before filling with conductive paste. This preliminary action prepares the surface by enhancing its adhesive properties, ensuring that the conductive paste forms strong bonds with the substrate and prevents disconnection under thermal or mechanical stress.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent uses a composite structure consisting of the primer layer and conductive paste filling the via-hole. This composite material approach combines the adhesive properties of the primer with the conductive properties of the paste, achieving both strong bonding and electrical connectivity.

Inventive Principle:

Principle #40Composite materials

3Manufacturing precision

If multiple manufacturing processes are used to form circuit patterns on both sides, then precise connections are achieved, but raw material loss increases and environmental pollution occurs

Engineering Contradiction:

Improveconnection precisionVSAvoidraw material loss

Core Design Contradiction:

Manufacturing precisionVSLoss of substance

Solution Approach 1:

The patent merges the circuit pattern formation processes for both sides of the substrate into a unified approach. By using conductive paste printing on both sides followed by a single plating process, the manufacturing steps are combined, reducing material waste and environmental impact while maintaining connection precision.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method reduces raw materials and manufacturing processes while ensuring high reliability of the double-sided flexible printed circuit board, preventing disconnection even under bending, heat, or physical impact, and improving adhesion and thermal stability.

Implementation Method 1

printing a conductive paste on the other side of the copper foil of the single-sided copper clad laminate to form a plated bottom layer on the via-hole simultaneously with forming a circuit pattern

Methodology Applied

Scientific EffectDeposition: Deposition (physical)

Implementation Method 2

plating a copper clad surface of the single-sided copper clad laminate, the via-hole including the plated bottom layer formed thereon, and the circuit pattern formed by printing the conductive paste

Methodology Applied

Scientific EffectElectroplating: Electroplating

Data Source

PatentUS9313900B2Method for manufacturing a double-sided printed circuit board

Publication Date: 2016.04.12 INKTEC CO LTD

AI summary

Disclosed is a method for manufacturing a double-sided printed circuit board (PCB) having a circuit pattern by printing a conductive paste. According to the method of the present invention, a circuit pattern that is precise and highly conductive can be formed, and a reduction in raw materials and the simplification of processes are made possible. Also, due to the printing of the conductive paste, short-circuit can be prevented even when a conductive layer is bent or exposed to heat or physical impact.