Double-Sided PCB Heat Vias for Compact Motor Driver Cooling
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Solution Overview
Problem
Image forming apparatuses face challenges in heat dissipation for motor driver ICs, leading to potential overheating and reduced performance due to the large current flow, which complicates part procurement and increases substrate area requirements.
Innovation Solution
A circuit board design with opposing surfaces for mounting different electronic parts, utilizing shared heat dissipation vias to connect regions and maintain efficient heat dissipation without increasing the substrate area, allowing for the use of replacement parts and minimizing the board's size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If separate heat dissipation vias are provided for each electronic part, then heat dissipation performance is improved, but the substrate area increases and device complexity increases
Solution Approach 1:
The patent merges heat dissipation resources by allowing electronic parts on opposite surfaces of the circuit board to share common heat dissipation vias. Specifically, a first electronic part on the first surface and a second electronic part on the second surface can both utilize the same via for heat dissipation, thereby consolidating heat dissipation functions and reducing the total number of vias required, which in turn reduces substrate area and device complexity while maintaining effective heat dissipation performance.
Solution Approach 2:
The patent implements universality by designing heat dissipation vias that serve multiple electronic parts simultaneously. A single via can function as a heat dissipation path for both the first electronic part on the first surface and the second electronic part on the second surface, making the via a multi-functional element that benefits multiple components without requiring dedicated vias for each part.
2Temperature
If separate heat dissipation vias are provided for each electronic part, then heat dissipation performance is improved, but device complexity increases
Solution Approach 1:
The patent merges heat dissipation functions by enabling shared use of vias between electronic parts on opposite surfaces. This consolidation reduces the total number of heat dissipation structures required, simplifying the overall device design and reducing complexity while still providing adequate heat dissipation for all electronic parts.
Solution Approach 2:
The patent creates universal heat dissipation vias that can serve multiple electronic parts simultaneously. This multi-functionality reduces device complexity by eliminating the need for separate dedicated vias for each electronic part, while maintaining effective heat dissipation performance across all components.
3Ease of manufacture
If electronic parts are mounted on single-sided circuit boards, then manufacturing is simpler, but heat dissipation performance is insufficient for high-current components
Solution Approach 1:
The patent transitions from single-sided to double-sided mounting, utilizing the third dimension (depth/thickness of the board) by mounting electronic parts on both the first and second opposite surfaces of the circuit board. This dimensional expansion allows for better heat dissipation through shared vias while maintaining manufacturing feasibility through standardized double-sided PCB processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively manages heat dissipation for motor driver ICs, reduces the risk of part procurement issues, and minimizes the circuit board's size without compromising heat dissipation performance, enabling continuous manufacturing and preventing overheating.
Implementation Method 1
the circuit board has a via for heat dissipation to be shared for heat dissipation of the first electronic part and the second electronic part formed therein to connect the first region and the second region to each other
Data Source
AI summary
A circuit board includes a first surface including a first region in which a first electronic part is mountable, and a second surface including a second region in which a second electronic part different from the first electronic part is mountable. The first region of the first surface and the second region of the second surface are provided at positions opposed to each other across the circuit board, and wherein the circuit board has a via for heat dissipation to be shared for heat dissipation of the first electronic part and the second electronic part formed therein to connect the first region and the second region to each other.