Double-Sided Power Module Layout for Balanced Chip Cooling
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Solution Overview
Problem
Existing power modules face challenges in achieving balanced heat dissipation between upper and lower substrates, leading to increased costs and reduced marketability due to the use of high heat dissipation materials, especially with high-performance chips and reduced chip area.
Innovation Solution
A power module design with chips disposed on upper and lower substrates, vertically spaced by a circuit board that electrically connects them, enhancing heat dissipation through distributed heat transfer and reducing chip overlap, allowing for increased chip density and simplified wiring.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If high heat dissipation materials are used to enhance heat dissipation performance, then heat dissipation performance is improved, but cost increases
Solution Approach 1:
The patent divides the heat dissipation function into two separate substrates (upper and lower substrates) that independently dissipate heat from respective chips. This segmentation allows each substrate to handle a portion of the heat load, achieving balanced heat dissipation without requiring expensive high-performance heat dissipation materials throughout the entire system.
Solution Approach 2:
The patent transitions from single-sided heat dissipation to double-sided heat dissipation by adding a vertical dimension. Chips are mounted on both upper and lower substrates, and heat is dissipated in two directions simultaneously, effectively doubling the heat dissipation capacity without proportionally increasing material costs.
2Quantity of substance
If chips are disposed close together to increase chip density, then output density is improved, but heat dissipation balance deteriorates
Solution Approach 1:
The patent segments the chip arrangement into two separate groups: chips on the upper substrate and chips on the lower substrate. This spatial segmentation allows high chip density to be achieved in each group while maintaining heat dissipation balance across the entire system, as each substrate independently manages the heat from its associated chips.
Solution Approach 2:
The patent utilizes the vertical dimension by stacking substrates above and below a central circuit board. This three-dimensional arrangement allows chips to be densely packed on each substrate while heat is dissipated in opposite vertical directions, preventing heat accumulation and maintaining thermal balance.
3Volume of moving object
If substrates are placed close together to reduce module size, then compactness is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent introduces a circuit board as an intermediary component between the upper and lower substrates. This circuit board serves as a structural support that defines and maintains the spacing between substrates, eliminating the need for high-precision direct substrate-to-substrate positioning and simplifying manufacturing requirements.
Solution Approach 2:
The circuit board performs multiple functions: it provides structural support for spacing, serves as an electrical connection path between chips on opposite substrates, and acts as a thermal management component. This multi-functionality allows compact module design without compromising manufacturing feasibility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves enhanced thermal performance and processability by distributing heat evenly between substrates, reducing chip overlap, and simplifying wiring, thereby increasing output density and reducing module size.
Implementation Method 1
heat generated from a chip is transferred to both an upper substrate and a lower substrate in a distributed manner
Data Source
AI summary
A power module includes an upper substrate and a lower substrate, an upper chip, a lower chip, and a circuit board disposed across a space between the upper substrate and the lower chip and a space between the lower substrate and the upper chip so that the upper substrate and the lower substrate are vertically spaced from each other. The circuit board electrically connects the upper chip to the lower substrate while electrically connecting the lower chip to the upper substrate.