Double-Sided Power Module Layout Without Wire Bonding
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Solution Overview
Problem
Existing power modules face challenges with heat dissipation and electrical connectivity issues due to wire bonding, which can lead to short-circuits and disconnection under high-power and high-current conditions, making it difficult to effectively dissipate heat from semiconductor elements.
Innovation Solution
A power module structure is designed with a spacer-integrated ceramic substrate on the upper portion and a lead frame-integrated ceramic substrate on the lower portion, utilizing a spacer to space the circuit patterns and enhance heat dissipation, while eliminating the need for wire bonding by forming electrode patterns directly on the ceramic substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wire bonding is used to connect semiconductor elements to substrate, then electrical connectivity can be achieved, but short-circuit or disconnection may occur under high-power and high-current conditions
Solution Approach 1:
The patent extracts and eliminates the wire bonding component from the electrical connection system. Instead of using separate wire bonds to connect semiconductor elements to the substrate, the invention integrates the circuit patterns directly onto the ceramic substrate, removing the potential failure points associated with wire bonding under high-power conditions.
Solution Approach 2:
The patent merges the substrate and circuit patterns into an integrated structure. The ceramic substrate incorporates printed circuit patterns directly formed on its surface, combining the mechanical support function and electrical connection function into a single integrated component, thereby eliminating the need for separate wire bonding connections.
2Use of energy by moving object
If wire bonding structure is used, then electrical signal transmission can be achieved, but heat dissipation from semiconductor elements becomes difficult
Solution Approach 1:
The patent introduces the ceramic substrate with integrated circuit patterns as an intermediary thermal management component. This substrate serves as both an electrical connection medium and a thermal conduction path, mediating between the semiconductor elements and the heat dissipation system, thereby improving heat dissipation efficiency while maintaining electrical signal transmission.
3Ease of manufacture
If traditional substrate structure is used, then assembly can be simplified, but thickness control of lead frame becomes difficult
Solution Approach 1:
The patent applies preliminary action by pre-forming the lead frame with precise thickness control before assembly. The lead frame is manufactured with controlled thickness in advance, and then integrated with the ceramic substrate during assembly, allowing both precise dimensional control and simplified final assembly.
4Temperature
If ceramic substrates are stacked with spacing, then heat dissipation effect is maximized, but device complexity increases
Solution Approach 1:
The patent applies multi-functionality to the spacer component. The spacer not only maintains the spacing between stacked ceramic substrates for heat dissipation purposes but also serves as a structural support element and alignment feature. This multi-functional design reduces overall device complexity despite the stacked configuration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design improves heat dissipation, electrical conductivity, and miniaturization by allowing for multiple semiconductor chip connections without wire bonding, reducing electrical risks and enhancing the overall performance and reliability of the power module.
Implementation Method 1
an electrode pattern part formed on the first circuit pattern and bonded to an electrode of a semiconductor chip mounted on the first ceramic substrate
Implementation Method 2
The lead frame may be bonded to the second ceramic substrate by one of brazing, welding, and Ag sintering bonding methods
Implementation Method 3
The lead frame may be bonded to the second ceramic substrate by one of brazing, welding, and Ag sintering bonding methods
Implementation Method 4
The lead frame may be bonded to the second ceramic substrate by one of brazing, welding, and Ag sintering bonding methods
Implementation Method 5
a spacer arranged between the first circuit pattern and the lead frame to space the first circuit pattern from the lead frame
Data Source
AI summary
The present invention relates to a power module and a manufacturing method therefor. The power module of the present invention is a doubled-sided type power module, wherein a spacer-integrated ceramic substrate is arranged on an upper portion of the power module with a semiconductor chip therebetween, and a lead frame-integrated ceramic substrate is arranged on a lower portion thereof, thereby maximizing a heat dissipation effect, easily controlling the thickness of a lead frame, and improving electrical characteristics. In addition, the present invention may improve electrical conductivity by forming an electrode pattern part integrated with a first circuit pattern.