Double-Sided Cooling Power Module With Integrated Circuit Spacers
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Solution Overview
Problem
Double-sided cooling power modules for vehicles face challenges in electrical connection and heat dissipation, with separate via spacers being prone to tilting and reducing durability due to thermal overlap effects and external shocks, and requiring larger sizes for high current conduction, which increases manufacturing costs and complexity.
Innovation Solution
Integrally formed spacers extending from the metal circuits of the upper and lower substrates eliminate the need for separate via spacers, enhancing electrical connection, reducing manufacturing complexity, and improving heat dissipation through copper's thermal conductivity, while glass frit in the spacers mitigates thermal expansion mismatch.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If separate via spacers are used to connect substrates, then electrical connection is achieved, but the spacers are prone to tilting and reduced durability due to thermal overlap effects and external shocks
Solution Approach 1:
The patent merges the via spacer with the metal circuit patterns on the substrates, forming an integrally formed spacer that is electrically connected to the metal circuits. This integration eliminates the separate via spacer component, preventing tilting issues and improving durability under thermal and mechanical stress while maintaining electrical connectivity.
2Reliability
If larger via spacers are used for high current conduction, then electrical connection capability is improved, but manufacturing costs and complexity increase
Solution Approach 1:
The integrally formed spacer is created as part of the existing metal circuit pattern formation process using screen printing and curing of conductive paste. This approach eliminates the need for separate via spacer manufacturing and assembly steps, reducing manufacturing complexity and costs while providing sufficient electrical connection capability for high current applications.
3Length of stationary object
If separate via spacers are used to secure space between substrates, then substrate spacing is achieved, but the manufacturing process becomes more complex
Solution Approach 1:
The spacer is formed integrally with the metal circuits through screen printing and curing, creating a unified structure that simultaneously provides electrical connectivity and mechanical spacing between substrates. This eliminates the need for separate spacer components and simplifies the manufacturing process by reducing the number of assembly steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution simplifies the manufacturing process, reduces costs, enhances thermal characteristics, and improves durability by eliminating the need for separate spacers and preventing tilting, while maintaining effective electrical connectivity and heat dissipation.
Implementation Method 1
curing the printed conductive paste
Implementation Method 2
glass frit in the spacers mitigates thermal expansion mismatch
Implementation Method 3
improving heat dissipation through copper's thermal conductivity
Implementation Method 4
bonding process including soldering or sintering
Data Source
AI summary
A power module for a vehicle, includes: a first substrate including a first metal circuit disposed on a 1-1st surface, and a first spacer extending from the first metal circuit in a first direction; a second substrate spaced from and facing the first substrate in a second direction, and including a second metal circuit disposed on a 2-1st surface facing the 1-1st surface, and a second spacer extending from the second metal circuit in the second direction; and a semiconductor chip disposed between the first substrate and the second substrate, the first spacer and the second spacer extending toward each other.