Double-Sided Power Electronic Package with Non-Planar Substrates
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Solution Overview
Problem
Conventional power electronic packaging technologies face limitations in thermal and mechanical performance, leading to high junction temperatures and stress on semiconductor chips due to one-sided cooling and wire-bonded connections, which restricts the operation of high-power semiconductor devices.
Innovation Solution
A power electronic package design featuring two high thermal conductivity insulating non-planar substrates with controlled mechanical separation and direct double-side cooling, eliminating wire bonds and providing a net axially-directed compressive force for uniform stress distribution and improved heat radiation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional one-sided cooling with wire bonds is used, then electrical connection is achieved, but thermal resistance increases and junction temperature exceeds limits
Solution Approach 1:
The patent transitions from one-sided cooling to double-sided cooling by adding a second cooling path through the substrate, effectively moving the cooling function from a single dimension to multiple dimensions. This reduces thermal resistance and junction temperature while maintaining electrical connection reliability.
Solution Approach 2:
The patent eliminates wire bonds from the conventional packaging structure, extracting the thermal and mechanical stress problems associated with wire bonds while maintaining electrical connection through direct substrate bonding of power and control electrodes.
2Temperature
If devices are moved apart to increase thermal spreading, then thermal performance improves, but module size increases and electrical parasitics increase
Solution Approach 1:
The patent utilizes the vertical dimension by implementing double-sided cooling through the substrate, allowing thermal spreading without increasing the horizontal footprint of the module. This maintains compact size while improving thermal performance.
3Temperature
If double-sided construction with metal bumps is used, then thermal conduction improves, but electrical resistance increases due to small connection area
Solution Approach 1:
The patent applies different connection methods to different regions: power electrodes use large-area direct bonding for both electrical and thermal performance, while control electrodes use wire bonds or other suitable methods. This local differentiation optimizes both electrical connection reliability and thermal conduction.
4Ease of manufacture
If asymmetric design layout is used, then assembly is simplified, but stress distribution becomes non-uniform causing large stresses on semiconductor chips
Solution Approach 1:
The patent employs asymmetric substrate thickness design where the first substrate is thicker than the second substrate. This asymmetric configuration is optimized to achieve uniform stress distribution on the semiconductor chips while maintaining assembly simplicity, resolving the contradiction between manufacturing ease and stress uniformity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces semiconductor chip stress, enhances heat radiation performance, and increases the reliability of power electronic packages by eliminating wire bonds and providing a robust thermal and electrical connection, suitable for high-power applications.
Implementation Method 1
two high thermal conductivity insulating non-planar substrates... enhanced heat radiation performance
Implementation Method 2
The mechanical separation provides a net axially-directed compressive force in the electronic components
Data Source
AI summary
A power electronic package includes: first and second high thermal conductivity insulating non-planar substrates; and a plurality of electronic components mounted on each of the substrates. The substrates are coupled each other at a plurality of bonding regions so that mechanical separation between the substrates is controlled by the number of the bonding regions, an arrangement of the bonding regions, a shape of each bonding region, and a material of the bonding regions. The mechanical separation provides a net axially-directed compressive force in the electronic components.