Double-Sided RDL Substrate for Compact RF Module Integration
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Solution Overview
Problem
Conventional side-by-side on package laminate configurations for RF front-end modules exceed the reduced form factor requirements of future RF applications in terms of XY size and Z height dimensions, posing a design challenge for integrating passive and active devices.
Innovation Solution
A wafer-level, double-sided redistribution layer (RDL) substrate is used for passive and active device integration, enabling a significant reduction in XY size and Z height through the use of interlayer dielectric layers and BEOL processes, eliminating the need for a laminate package substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If conventional side-by-side on package laminate configurations are used, then passive and active devices can be integrated, but XY size and Z height dimensions exceed the reduced form factor requirements
Solution Approach 1:
The patent transitions from a conventional side-by-side planar arrangement to a three-dimensional stacked configuration where passive devices and active devices are positioned on opposite sides of the RDL substrate. This vertical stacking approach enables device integration while significantly reducing the XY footprint to meet reduced form factor requirements.
Solution Approach 2:
The patent embeds passive devices within the substrate structure itself, integrating them into the RDL layers and interlayer dielectric regions. This nesting approach allows passive and active devices to coexist in a compact volume, reducing overall XY size while maintaining integration capability.
2Adaptability or versatility
If conventional side-by-side on package laminate configurations are used, then passive and active devices can be integrated, but Z height dimension exceeds the reduced form factor requirements
Solution Approach 1:
The patent redistributes device components along the Z-axis through selective stacking, positioning passive devices at different heights relative to active devices. The RDL substrate acts as an intermediary layer that enables this vertical arrangement, achieving device integration while controlling overall Z height within reduced form factor constraints.
3Area of stationary object
If RDL substrate with double-sided integration is used, then XY size and Z height are reduced, but manufacturing complexity increases
Solution Approach 1:
The patent divides the substrate into distinct functional regions: a first surface for passive device integration with RDL layers and interlayer dielectric, and a second surface for active device coupling. This segmentation allows independent optimization and manufacturing of each side, reducing overall manufacturing complexity despite the advanced integrated structure.
Solution Approach 2:
The RDL substrate serves as an intermediary structure that mediates between passive devices on the first surface and active devices on the second surface. This intermediary approach simplifies the manufacturing process by providing standardized interfaces and connection pathways, reducing the complexity that would otherwise arise from direct integration requirements.
Data Source
AI summary
A device includes a redistribution layer (RDL) substrate. The device also includes a passive component in the RDL substrate proximate a first surface of the RDL substrate. The device further includes a first die coupled to a second surface of the RDL substrate, opposite the first surface of the RDL substrate.