Double-Sided Scrubber With Multi-Liquid Nozzles for Compact Wafer Cleaning
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Solution Overview
Problem
Conventional wet processing systems for semiconductor substrates require multiple tanks in series, occupying significant factory space and introducing inefficiencies due to the need for sequential dipping in different chemicals, which is time-consuming and inefficient.
Innovation Solution
A double-sided scrubber with rotating brushes and multiple sets of nozzles that spray different chemicals and DI water simultaneously at the substrate interface, allowing for efficient and space-saving cleaning by alternating liquid application without time lag.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If multiple tanks are arranged in series for sequential chemical processing, then thorough cleaning of substrate surfaces is achieved, but significant factory floor space is occupied
Solution Approach 1:
The patent combines multiple chemical processing tanks into a single integrated chamber where substrates are processed through multiple chemicals sequentially without physical relocation between separate tanks. The substrate moves through a first chemical region, then a second chemical region, and finally a rinse region within the same chamber, eliminating the need for multiple separate tank installations and reducing factory floor space while maintaining thorough cleaning capability.
Solution Approach 2:
The patent transitions from a horizontal arrangement of multiple tanks in series to a vertical or multi-zoned arrangement within a single chamber. By organizing chemical processing zones vertically or in sequential spatial zones within one chamber rather than spreading tanks horizontally across the factory floor, the system achieves the same cleaning function in a compact footprint.
2Manufacturing precision
If substrates are sequentially dipped in multiple chemical tanks, then comprehensive contaminant removal is achieved, but the process becomes time-consuming and inefficient
Solution Approach 1:
The patent enables continuous processing by allowing substrates to move sequentially through different chemical zones within a single chamber without stopping or being manually transferred between tanks. The substrate continuously progresses from the first chemical region through the second chemical region to the rinse region, eliminating idle time between dipping operations while ensuring thorough contaminant removal through exposure to multiple chemicals in sequence.
3Adaptability or versatility
If multiple separate tanks are used for different chemicals, then specialized chemical processing is achieved, but system complexity and inefficiency increase
Solution Approach 1:
The patent merges multiple chemical processing functions into a single integrated chamber that houses regions for different chemicals (first chemical, second chemical, and rinse solution). This consolidation maintains the ability to perform specialized chemical processing for different contaminant types while reducing system complexity by eliminating the need for multiple separate tank systems, pumps, and control mechanisms.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The double-sided scrubber effectively cleans semiconductor substrates with reduced space requirements and improved efficiency by enabling simultaneous chemical application, enhancing the cleaning process while minimizing redeposition of debris.
Implementation Method 1
a double-sided scrubber including a pair of brushes. Each brush of the pair of brushes may be (a) substantially cylindrical and may be configured to rotate about a longitudinal axis of the brush
Implementation Method 2
A first set of nozzles may be fluidly coupled together and configured to spray a first liquid at an interface between the substrate and the pair of brushes
Data Source
AI summary
A substrate cleaning device includes a double-sided scrubber that directs a liquid to a substrate as it moves back-and-forth between a pair of rotating brushes. The device may also include a first set of nozzles and a second set of nozzles. The first set of nozzles may be configured to spray a first liquid at an interface between the substrate and rotating brushes and the second set of nozzles may be configured to spray a second liquid at the interface as the substrate moves back-and-forth between the pair of rotating brushes.