Double-Sided Power Semiconductor Packaging for Scalable Module Assembly
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Solution Overview
Problem
The production process for power semiconductor modules is complicated, inflexible, and costly, with difficulties in manipulating and forming contacts, leading to lower efficiency and scalability.
Innovation Solution
A semiconductor package design with thermal and electrical contact on both sides of power semiconductors, eliminating insulating layers, and using rigid contact units and flexible terminal connectors, allowing for efficient production and flexible design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional production processes with ceramic substrates and wire-bonding are used, then reliable electrical and thermal contact is achieved, but the production process becomes complicated and inflexible
Solution Approach 1:
The patent divides the power semiconductor module into multiple independent semiconductor chips, each with its own contact units. This segmentation allows each chip to be manufactured and tested independently, simplifying the overall production process while maintaining reliable electrical and thermal contact through standardized contact unit designs.
Solution Approach 2:
The contact units are designed to serve multiple functions simultaneously - providing both electrical connection and thermal management. This multi-functionality eliminates the need for separate ceramic substrates and wire-bonding processes, simplifying the production process while ensuring reliable performance.
2Ease of manufacture
If traditional power semiconductor modules are designed with fixed configurations, then manufacturing stability is maintained, but adaptability to different power converter requirements is reduced
Solution Approach 1:
The patent enables dynamic configuration of power semiconductor modules by allowing different numbers and types of semiconductor chips to be combined using standardized contact units. This dynamic approach maintains manufacturing stability through standardization while providing adaptability to meet different power converter requirements.
Solution Approach 2:
The invention allows for parameter changes in module design by varying the number, type, and arrangement of semiconductor chips while maintaining consistent contact unit interfaces. This enables flexible adaptation to different power converter specifications without compromising manufacturing stability.
3Power
If numerous power semiconductors are connected in parallel to increase conductive capacity, then power handling capability is improved, but the complexity of forming contacts and manipulating components increases
Solution Approach 1:
The patent merges the electrical connection and thermal management functions into unified contact units that directly contact the semiconductor chips. This merging simplifies the process of connecting numerous power semiconductors in parallel by providing standardized, integrated connection points that reduce the overall complexity of contact formation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient, flexible, and scalable production of power semiconductor modules with improved thermal and electrical contact, reducing costs and enhancing performance.
Implementation Method 1
a first contact unit for the first side, which is in thermal and electrical contact with the majority of the surface of the first side
Implementation Method 2
a first contact unit for the first side, which is in thermal and electrical contact with the majority of the surface of the first side
Implementation Method 3
a second contact unit for the second side, which is in thermal and electrical contact with the majority of the surface of the second side
Implementation Method 4
a second contact unit for the second side, which is in thermal and electrical contact with the majority of the surface of the second side
Data Source
AI summary
A semiconductor package for a power semiconductor module in a power converter has a power semiconductor with a first side, an opposing second side, and a control terminal on the first side, a first contact unit for obtaining contact to the first side, wherein the first contact unit is in thermal and electrical contact with a majority of the surface of the first side, a second contact unit for obtaining contact to the second side, wherein the second contact unit is in thermal and electrical contact with a majority of the surface of the second side, and a terminal connector for connecting the control terminal on the power semiconductor to a control unit. A power semiconductor module for a power converter and a method for the production of numerous semiconductor packages are also disclosed.