Double-Sided SiP Encapsulation for Smaller Module Footprints
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Solution Overview
Problem
Existing semiconductor devices face challenges in achieving smaller sizes while maintaining advanced features, particularly in double-sided System-in-Package (SiP) modules, due to encapsulation difficulties as module size is reduced.
Innovation Solution
A method for forming double-sided SiP modules by mounting components on both sides of a substrate, using selective encapsulation to expose critical connectors and forming a shielding layer, while ensuring environmental protection and electrical connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If components are mounted on both sides of the substrate to reduce footprint, then the SiP module achieves smaller size, but encapsulation becomes more difficult and complex
Solution Approach 1:
The patent divides the encapsulation process into two separate stages: first encapsulating components on the first side of the substrate, then encapsulating components on the second side. This segmentation allows each encapsulation operation to be performed independently, simplifying the manufacturing process while achieving complete coverage of both sides of the SiP module.
Solution Approach 2:
The patent introduces a carrier substrate that extends beyond the edges of the main substrate, creating an overhang structure. This dimensional extension provides a platform for mounting components on the second side that are positioned over the edges of the first substrate, allowing encapsulant to flow and cure properly without interfering with components on the first side.
2Productivity
If module size is reduced to achieve smaller footprint, then manufacturing efficiency improves, but encapsulation challenges increase
Solution Approach 1:
The patent performs preliminary encapsulation of the first side of the substrate before mounting components on the second side. This preliminary action protects the first-side components during subsequent manufacturing steps and allows the second-side components to be positioned and encapsulated without risking damage to the first-side components, thereby simplifying the overall process.
Solution Approach 2:
The carrier substrate acts as an intermediary structure that facilitates the encapsulation process. It provides a temporary platform for mounting second-side components and serves as a barrier that prevents encapsulant from interfering with first-side components, enabling simplified two-sided encapsulation.
3Reliability
If selective encapsulation is used to expose critical connectors, then electrical connectivity is maintained, but manufacturing precision requirements increase
Solution Approach 1:
The patent applies encapsulant selectively to different regions of the substrate. The first encapsulant covers the first side of the substrate while leaving second-side connectors exposed, and the second encapsulant covers the second side while avoiding the exposed connectors. This local differentiation of encapsulation coverage maintains electrical connectivity while providing environmental protection where needed.
Data Source
AI summary
A semiconductor device has a substrate and a first component disposed over a first surface of the substrate. A connector is disposed over the first surface of the substrate. A first encapsulant is deposited over the first component while the connector remains outside of the first encapsulant. A shielding layer is formed over the first encapsulant while the connector remains outside of the shielding layer. A second component is disposed over a second surface of the substrate. A solder bump is disposed over the second surface of the substrate. A second encapsulant is deposited over the second surface of the substrate. An opening is formed through the second encapsulant to expose the solder bump. A solder ball is disposed in the opening. The solder ball and solder bump are reflowed to form a combined solder bump.