Double-Sided SiP Module Encapsulation With Exposed Connectors
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Solution Overview
Problem
The challenge lies in scaling down double-sided System-in-Package (SiP) modules to smaller sizes while maintaining advanced features, as encapsulating components on both sides of the substrate becomes increasingly difficult with reduced module size.
Innovation Solution
The method involves forming double-sided SiP modules by mounting components on both sides of a package substrate, using a combination of conductive and insulating layers, and employing selective encapsulation techniques to protect discrete components while keeping board-to-board connectors exposed for signal stability, along with a shielding layer for electromagnetic interference protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If components are mounted on both sides of the substrate to reduce footprint, then the component integration density is improved, but the encapsulation difficulty increases
Solution Approach 1:
The patent divides the encapsulation process into two separate stages: first encapsulating components on one side of the substrate, then flipping the substrate to encapsulate components on the opposite side. This segmentation of the encapsulation operation allows each side to be processed independently, resolving the technical contradiction by making double-sided encapsulation feasible while maintaining high component integration density.
2Area of stationary object
If module size is reduced to meet market demands, then the footprint is improved, but the encapsulation process becomes more difficult
Solution Approach 1:
By segmenting the encapsulation process into separate operations for each side of the substrate, the patent enables reduced module footprint while avoiding the complexities of attempting to encapsulate all components in a single operation. The segmented approach maintains manufacturability even as overall device size decreases.
Solution Approach 2:
The patent performs preliminary mounting of components on both sides of the substrate before initiating the encapsulation process. This preliminary action allows the encapsulation material to be applied more effectively to smaller features, enabling reduced footprint designs while maintaining ease of manufacture through proper process sequencing.
Data Source
AI summary
A semiconductor device has a substrate and a first component disposed over a first surface of the substrate. A connector is disposed over the first surface of the substrate. A first encapsulant is deposited over the first component while the connector remains outside of the first encapsulant. A shielding layer is formed over the first encapsulant while the connector remains outside of the shielding layer. A second component is disposed over a second surface of the substrate. A solder bump is disposed over the second surface of the substrate. A second encapsulant is deposited over the second surface of the substrate. An opening is formed through the second encapsulant to expose the solder bump. A solder ball is disposed in the opening. The solder ball and solder bump are reflowed to form a combined solder bump.