Double-Sided Substrate Heat Radiation via Asymmetric Placement
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Solution Overview
Problem
There is no established technique for achieving efficient heat radiation in electronic units using a double-sided thick copper substrate, which can lead to temperature increases in transformers and other devices.
Innovation Solution
The electronic unit incorporates a double-sided substrate with patterned metal plates bonded on both sides of an insulation substrate, along with heat radiation members positioned adjacent to the plate generating more heat, allowing for efficient heat dissipation by using a thick copper substrate with patterned copper plates and heat radiation members made of low resistance materials like aluminum.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If a double-sided thick copper substrate is used in electronic units, then the electrical conductivity and current carrying capacity are improved, but the heat radiation efficiency deteriorates
Solution Approach 1:
The patent applies local quality by differentiating the treatment of each metal plate based on its heat generation characteristics. The first metal plate (with higher heat generation) is positioned adjacent to the heat radiation member, while the second metal plate (with lower heat generation) is positioned away from it. This localized arrangement optimizes heat radiation efficiency for each specific heat source within the double-sided substrate structure.
Solution Approach 2:
The patent employs asymmetry by creating an uneven configuration where heat radiation members are selectively positioned adjacent to only one of the two metal plates (the one generating more heat). This asymmetric heat radiation arrangement breaks the symmetry of the double-sided substrate, allowing optimized thermal management without compromising the electrical functionality of both sides.
2Temperature
If heat radiation members are added to improve heat dissipation, then the temperature control is improved, but the device complexity increases
Solution Approach 1:
The patent applies local quality by differentiating the treatment of each metal plate based on its heat generation characteristics. The first metal plate (with higher heat generation) is positioned adjacent to the heat radiation member, while the second metal plate (with lower heat generation) is positioned away from it. This localized arrangement optimizes heat radiation efficiency for each specific heat source within the double-sided substrate structure.
Solution Approach 2:
The patent employs asymmetry by creating an uneven configuration where heat radiation members are selectively positioned adjacent to only one of the two metal plates (the one generating more heat). This asymmetric heat radiation arrangement breaks the symmetry of the double-sided substrate, allowing optimized thermal management without compromising the electrical functionality of both sides.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables direct and efficient heat radiation from the primary and secondary coils, effectively preventing temperature increases in transformers and other electronic units by strategically placing heat radiation members near the plates with higher heat generation.
Implementation Method 1
a heat radiation member for releasing heat from the double-sided substrate
Implementation Method 2
The heat radiation member is disposed adjacent to one of the first metal plate and the second metal plate generating a larger amount of heat than the other
Data Source
AI summary
An electronic unit includes a double-sided substrate having an insulation substrate, a patterned first metal plate bonded on one side of the insulation substrate, and a patterned second metal plate bonded on the other side of the insulation substrate, and also includes a heat radiation member for releasing heat from the double-sided substrate. The heat radiation member is disposed adjacent to one of the first metal plate and the second metal plate generating a larger amount of heat than the other of the first metal plate and the second metal plate.