Double-Sided Substrate Optoelectronic Circuit Design
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Solution Overview
Problem
Conventional optoelectronic circuits face limitations in density, optical and electrical interconnection length, and form factor, leading to increased losses and reduced functionality.
Innovation Solution
The use of double-sided substrates with planar optical waveguides and electrically conducting tracks, allowing for the creation of a hybrid integration optoelectronic circuit with stacked assemblies that optically and electrically connect optoelectronic devices across substrates via vias, enhancing component density and reducing interconnection lengths.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If conventional optoelectronic circuits are used with single-sided substrates, then the circuit layout is simple, but the component density is low and interconnection lengths are long
Solution Approach 1:
The patent transitions from conventional single-sided substrate layout to double-sided substrate architecture, utilizing the third dimension (vertical stacking) to increase component density. Optical waveguides and electronic components are distributed across both surfaces of the substrate, with interconnections passing through the substrate thickness, effectively transforming a 2D layout problem into a 3D spatial utilization solution.
2Loss of energy
If interconnection length is reduced in conventional circuits, then optical and electrical losses are reduced, but component density cannot be increased
Solution Approach 1:
By distributing components across both surfaces of the substrate and routing interconnections through the substrate thickness, the patent simultaneously achieves shorter interconnection paths and higher component density. The vertical dimension enables direct coupling between corresponding components on opposite surfaces, minimizing lateral interconnection lengths while maximizing spatial utilization.
3Productivity
If double-sided substrates with vias are used, then component density increases and interconnection lengths decrease, but manufacturing complexity increases
Solution Approach 1:
The patent divides the optoelectronic circuit into distinct functional layers on each substrate surface, with optical waveguides, electronic components, and interconnection structures independently configured on each side. This segmentation allows separate optimization and fabrication of each surface, followed by precise alignment and bonding, thereby managing manufacturing complexity while achieving high integration density.
4Length of stationary object
If conventional single-sided substrate layout is used, then manufacturing is simpler, but optical and electrical interconnections are longer causing higher losses
Solution Approach 1:
The patent utilizes the substrate thickness dimension to create direct vertical interconnections between corresponding components on opposite surfaces, dramatically reducing interconnection length compared to lateral routing on a single surface. This dimensional transition enables short, direct optical and electrical pathways through the substrate, minimizing propagation losses.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration results in higher optical and electrical component density, reduced losses, and improved functionality by enabling shorter interconnections and a more compact form factor.
Implementation Method 1
the planar substrate has a via crossing said substrate and configured to optically connect the first planar optical waveguide and the second planar optical waveguide
Data Source
AI summary
An optoelectronic circuit having a substantially planar double-sided substrate, each side of which has a respective plurality of electrically conducting tracks and a respective plurality of planar optical waveguides. The substrate also has at least one via crossing the substrate in a manner that can be used to establish an optical path across the substrate, e.g., between optical waveguides located on different sides thereof. In an example embodiment, the electrically conducting tracks and planar optical waveguides are configured to operatively connect various optoelectronic devices and auxiliary electrical circuits attached to the two sides of the substrate using hybrid-integration technologies. In some embodiments, two or more of such double-sided substrates can be stacked and optically and electrically interconnected to create an integrated three-dimensional assembly.