Double-Sided Waffle Pack for Semiconductor Die Orientation
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Solution Overview
Problem
Conventional single-sided waffle packs require flipping and alignment assistance for semiconductor die handling, leading to limited throughput and potential damage due to misalignment and jostling during the flipping process.
Innovation Solution
A double-sided waffle pack design with vertically aligned cavities on both sides allows for simultaneous flipping and alignment of semiconductor die, enabling efficient transfer from bump-side up to bump-side down orientation without the need for a flipping jig, reducing damage and increasing processing efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional single-sided waffle packs are used with flipping jig, then axial alignment can be achieved, but throughput is limited and device complexity increases
Solution Approach 1:
The patent combines the alignment and flipping functions into the waffle pack structure itself by providing cavities on both sides of the same pack. The first cavity holds the die in the first orientation, and the second cavity holds the die in the second orientation. When the waffle pack is flipped, the die automatically transitions from the first cavity to the second cavity, achieving both alignment and orientation change in a single operation without requiring a separate flipping jig.
Solution Approach 2:
The waffle pack is divided into two functional sides: a first side with first cavities for holding die in the first orientation, and a second side with second cavities for holding die in the second orientation. This segmentation allows each side to be optimized for its specific function while working together to solve the alignment and throughput problems.
2Measurement precision
If conventional single-sided waffle packs are flipped one at a time, then alignment can be maintained, but processing time increases
Solution Approach 1:
Multiple waffle packs are stacked together with their cavities substantially aligned vertically, forming a combined structure. The die in each pack are substantially aligned vertically as well. When the entire stack is flipped together, all die are reoriented simultaneously while maintaining alignment, eliminating the time loss associated with flipping packs one at a time.
3Manufacturing precision
If flipping jig is used for axial alignment, then misalignment is reduced, but device complexity and operation difficulty increase
Solution Approach 1:
The alignment function is merged into the waffle pack structure itself through the provision of substantially vertically aligned first and second cavities. This eliminates the need for external alignment aids like flipping jigs, thereby simplifying the operation while maintaining manufacturing precision.
4Ease of operation
If die are flipped using conventional method, then orientation change is achieved, but die jostling and bump damage occur
Solution Approach 1:
The waffle pack structure is prepared in advance with both first and second cavities positioned to receive the die in their respective orientations. The cavities are designed with appropriate dimensions and positioning to securely hold the die throughout the flipping process. This preliminary preparation ensures that when flipping occurs, the die are already positioned to minimize jostling and protect the solder bumps from damage.
Data Source
AI summary
Double-sided waffle packs and methods of using the same are provided. In one aspect, a waffle pack is provided that includes a body that has a first side and second side opposite the first side. The first side has a first cavity for enabling a semiconductor die to be seated therein when the body is in a first orientation. The second side has a second cavity for enabling a semiconductor die to be seated therein when the body is in a second orientation opposite the first orientation. The first cavity has a first footprint and the second cavity has a second footprint. The first and second footprints are substantially aligned vertically.