Double Silicon Lens Layout for Precise Grating Coupler Alignment
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Solution Overview
Problem
Existing optical signaling and processing systems face challenges in achieving efficient coupling between optical and electrical components due to misalignment of grating couplers with lenses, leading to reduced coupling efficiency and increased beam size, which limits the integration of high-performance electrical devices.
Innovation Solution
The implementation of a double silicon lens configuration, with one lens on each side of the substrate, optically coupled to the optical device, to improve process variation and reduce light refraction errors, enhancing directionality and coupling efficiency while minimizing fiber light loss.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a single lens configuration is used, then the device complexity is reduced, but the coupling efficiency decreases and beam size increases due to misalignment and refraction errors
Solution Approach 1:
The optical system is segmented into two separate lenses positioned on opposite sides of the substrate. Each lens independently corrects optical aberrations, and together they achieve superior coupling efficiency compared to a single lens. The first lens is formed on the first side of the substrate while the second lens is formed on the second side, dividing the correction function across multiple components.
Solution Approach 2:
The solution transitions from a single-plane lens configuration to a dual-plane configuration by placing lenses on both sides of the substrate. This dimensional expansion allows for correction of refraction errors that occur as light passes through the substrate thickness, addressing limitations that cannot be solved with a single-plane approach.
2Area of stationary object
If the grating coupler size is reduced to increase device integration, then more electrical devices can be integrated, but the alignment tolerance decreases making coupling more difficult
Solution Approach 1:
The double lens system performs preliminary correction of beam divergence and refraction errors before the light reaches the grating coupler. This preliminary optical conditioning ensures that even small grating couplers receive well-collimated light, maintaining high coupling efficiency despite reduced alignment tolerance that comes with smaller coupler sizes.
3Adaptability or versatility
If optical components are integrated with electrical components in the same package, then full-fledged applications are enabled, but the space available for electrical devices is reduced
Solution Approach 1:
The dual-sided lens configuration utilizes the third dimension (substrate thickness) to accommodate optical components. By forming lenses on both the first and second sides of the substrate, the design efficiently uses vertical space rather than lateral space, thereby preserving more planar area for electrical device integration while maintaining full optical functionality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The double silicon lens configuration optimizes beam size and improves coupling efficiency, allowing for reduced grating coupler size and increased integration of high-performance electrical devices in the package.
Implementation Method 1
reduce light refraction errors
Data Source
AI summary
A semiconductor device includes a silicon substrate having a first side and a second side opposite to each other, and further having a first region and a second region on. The semiconductor device includes a first silicon lens formed in the first region and along a first surface of the silicon substrate on the first side of the silicon substrate. The semiconductor device includes a second silicon lens formed in the first region and along a second surface of the silicon substrate on the second side of the silicon substrate. The semiconductor device includes a photonic die disposed in the first region and on the second side of the silicon substrate.