Double-Spiral Package Filter Structure for Signal and Power Integrity
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Solution Overview
Problem
Current semiconductor packaging technologies face challenges in ensuring signal and power integrity, leading to performance inefficiencies and increased manufacturing costs due to the need for external integrated passive devices and complex packaging processes.
Innovation Solution
The implementation of a package structure that incorporates dummy dies with MOS capacitors or integrated passive devices within the redistribution circuit structure, which provide capacitance adaptive control and noise suppression, allowing for improved signal and power integrity without external components, and utilizing a debond layer and redistribution circuit structure for efficient packaging.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If external integrated passive devices are used to ensure signal and power integrity, then signal and power integrity are improved, but device complexity and manufacturing costs increase
Solution Approach 1:
The patent integrates passive devices (capacitors, inductors, resistors) directly into the semiconductor die, merging previously separate components into a single integrated structure. This eliminates the need for external passive devices and complex packaging processes while maintaining signal and power integrity through on-die noise suppression mechanisms.
2Reliability
If external integrated passive devices are used for noise suppression, then signal and power integrity are improved, but manufacturing costs increase
Solution Approach 1:
The patent combines passive devices with the semiconductor die into a single integrated structure, eliminating the need for separate external passive components. This integration reduces manufacturing costs by simplifying the packaging process and reducing the number of discrete components that need to be assembled and connected.
3Productivity
If minimum feature size is shrunk to improve processing capabilities and power consumption, then processing capabilities and power consumption are improved, but signal and power integrity become increasingly critical
Solution Approach 1:
The patent addresses signal and power integrity challenges arising from feature size shrinkage by integrating three-dimensional passive devices within the semiconductor die structure. This vertical integration approach allows noise suppression mechanisms to be positioned strategically close to sensitive circuits, maintaining reliability despite reduced feature sizes and increased device density.
Data Source
AI summary
A package structure includes an insulating encapsulation, a semiconductor die, and a filter structure. The semiconductor die is encapsulated in the insulating encapsulation. The filter structure is electrically coupled to the semiconductor die, wherein the filter structure includes a patterned metallization layer with a pattern having a double-spiral having aligned centroids thereof.