Double-Spring Test Pin for Precise Semiconductor Contact
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Solution Overview
Problem
Existing test pins for inspecting semiconductors and camera modules suffer from decreased measurement precision and increased manufacturing complexity due to multiple components, leading to reduced yield and inefficient heat dissipation.
Innovation Solution
A test pin with a top plunger and a bottom plunger having a double spring structure, where the bottom plunger elastically supports the load applied by the top plunger, improving electrical contact and heat dissipation while minimizing components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If multiple components (housing, upper plunger, lower plunger, coil spring) are provided as separate parts, then the test pin can perform basic testing functions, but manufacturing workability deteriorates and work time increases due to assembly complexity
Solution Approach 1:
The patent combines the housing, coil spring, and plunger into a single integrated component called a spring plunger. This merging eliminates the need for separate assembly of multiple parts, thereby improving manufacturing workability and reducing the number of components while maintaining the elastic support function and electrical contact capability.
2Measurement precision
If repeated tests are performed on multiple inspection targets, then inspection coverage increases, but measurement precision decreases due to wear and lifetime degradation
Solution Approach 1:
The patent applies a downward load to the spring plunger, which changes the contact pressure parameter between the test pin and inspection target. This increased pressure improves electrical contact quality and measurement precision even after repeated tests, counteracting the degradation that would normally occur with increased usage and lifetime wear.
3Measurement precision
If electrical contact is increased by applying load, then measurement precision improves, but heat generation increases during testing
Solution Approach 1:
The patent converts the harmful effect of heat generation into a beneficial outcome by using the downward load to simultaneously achieve two things: improving electrical contact for better measurement precision while the same load pressure enhances heat dissipation efficiency. The increased contact pressure that causes heat also improves thermal conduction to dissipate the heat more effectively.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The test pin enhances measurement precision, reduces manufacturing costs, and improves workability by efficiently dissipating heat and maintaining electrical contact through a double spring structure.
Implementation Method 1
the bottom plunger elastically supports a load applied from the top plunger by adopting a double spring structure
Implementation Method 2
a bottom plunger which transmits the electrical signal received from inspection equipment to the top plunger
Implementation Method 3
it is possible to improve heat generation performance by dissipating heat generated during the test process to the outside through the bottom plunger having a double spring structure
Data Source
AI summary
Provided is a test pin for inspecting the presence of an electrical defect in a semiconductor and a camera module, the test pin comprising: a top plunger which is in contact with an object to be inspected to transmit an electrical signal thereto, and detects an output signal output from the object to be inspected; and a bottom plunger which transmits, to the top plunger, an electrical signal received from inspection equipment and transmits, to the inspection equipment, a monitoring signal detected by the top plunger, wherein the bottom plunger adopts a double spring structure and thus is configured to elastically support a load applied from the top plunger, such that the object to be inspected may be precisely inspected for the presence of an electrical defect, and electrical contact of the test pin may be improved, thereby increasing measurement precision.