Double-Sided Multi-Spectral Photosensitive Device for Bidirectional Sensing
Solution Overview
Problem
Traditional color image photosensitive chips face limitations in sensitivity and spatial resolution due to color filtering, and they struggle to sense light from two different directions simultaneously, leading to inefficiencies in energy utilization and complex manufacturing processes.
Innovation Solution
A multi-spectrum photosensitive device with a double-sided, double-layer design featuring photosensitive pixel groups on both sides of a base layer, allowing simultaneous sensing of different spectrums from both directions, and utilizing a direction-selecting means such as shutters or shading films to optimize light utilization and reduce interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If color filtering films are used in traditional photosensitive chips, then color information can be obtained, but sensitivity and spatial resolution are reduced
Solution Approach 1:
The photosensitive chip is divided into multiple independent photosensitive pixels arranged in arrays on both front and back surfaces. Each pixel can independently sense light without requiring color filtering films, achieving color information acquisition through spatial segmentation of multiple pixels rather than spectral filtering.
Solution Approach 2:
The invention transitions from single-sided sensing to double-sided sensing, adding a spatial dimension by placing photosensitive pixels on both the front and back surfaces of the chip. This enables simultaneous acquisition of color information from different directions without compromising sensitivity.
2Ease of manufacture
If single-layer photosensitive pixels are used, then manufacturing is simpler, but the ability to sense multiple spectrums simultaneously is limited
Solution Approach 1:
The chip is segmented into multiple photosensitive pixels with different spectral response characteristics arranged in specific patterns. This allows each pixel to be relatively simple in structure while the collective array provides multi-spectrum sensing capability through the diversity of individual pixel responses.
Solution Approach 2:
Each photosensitive pixel is designed to respond to multiple spectral ranges simultaneously rather than being specialized for a single wavelength. This universal response characteristic, combined with the spatial arrangement of pixels, enables the system to capture multiple spectrums including visible light and infrared without requiring complex multi-layer structures.
3Measurement precision
If photosensitive pixels are arranged in traditional patterns (Bayer or Honeycomb), then color interpolation can be performed, but effective spatial definition is reduced
Solution Approach 1:
The pixel array is segmented into multiple functional zones with different spectral response characteristics arranged in regular geometric patterns. This segmentation allows direct spatial sampling of multiple spectrums without requiring post-processing interpolation, thereby maintaining high spatial resolution while achieving complete color information.
4Device complexity
If a single processing circuit is used for bidirectional sensing, then device complexity is reduced, but managing light from two directions becomes challenging
Solution Approach 1:
The processing circuits from front-side and back-side sensing are merged into a single integrated processing circuit that handles signals from both directions. This unified circuit architecture reduces overall device complexity while efficiently managing bidirectional light information through integrated signal processing pathways.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the manufacturing process, enhances sensitivity and color representation, and enables bidirectional sensing with a single processing circuit, reducing space and cost while maintaining high sensitivity and dynamic range.
Implementation Method 1
at least two of the sides are provided with photosensitive pixel groups, each of the photosensitive pixel groups being used for sensing light of interested spectrum
Data Source
Figure 1
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Figure 3(a)~3(b)
AI summary
The present disclosure relates to a multi-spectrum photosensitive device and manufacturing method thereof. The multi-spectrum photosensitive device comprises at least one opaque base layer; each base layer having at least two sides, at least two of the sides are provided with photosensitive pixel groups, each photosensitive pixel group is used for sensing light of either spectrum irradiated from the obverse direction of the located side. Alternatively, the multi-spectrum photosensitive device comprises at least one transparent base layer; each base layer having at least two sides, at least two of the sides are provided with photosensitive pixel groups, each photosensitive pixel group is used for sensing light of interested spectrum irritated from the obverse direction or reverse direction of the located side. The present invention could be used to simultaneously sense different views of two directions or to sense a view of one direction by using the same sensing device to carry out double-direction sensing, thereby improving the performance of sensing device.