Downhole Electronic Cooling System With Nested Heat Exchangers
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Solution Overview
Problem
Current cooling systems for electronic devices used in downhole operations, particularly laser perforating gun systems, are complex and unreliable, leading to operational failures due to high heat generation and lack of effective heat dissipation, which can damage the devices and hinder their use in well drilling and perforating operations.
Innovation Solution
A downhole electronic device cooling system comprising a first heat exchanger element internal to a heat exchanger vessel and a second heat exchanger element associated with the electronic device, both in fluid communication with a cooling fluid, allowing for the circulation of a secondary cooling fluid to efficiently manage heat dissipation, with the system positioned in the well annulus and connected to a flexitube for fluid circulation and temperature regulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a cooling system is implemented for laser emitting devices in downhole operations, then the device temperature is maintained at acceptable levels, but the system complexity increases
Solution Approach 1:
The cooling system employs a nested structure where an inner heat exchanger vessel containing the primary cooling circuit is positioned inside an outer heat exchanger vessel containing the secondary cooling circuit. This nested arrangement allows both cooling functions to be integrated in a compact configuration, maintaining effective temperature control while reducing overall system complexity and space requirements.
Solution Approach 2:
The patent combines primary and secondary cooling circuits into a single integrated heat exchanger assembly. The primary cooling fluid circulates through the inner vessel while the secondary cooling fluid circulates through the outer vessel, merging multiple cooling functions into one unified system that simplifies operation and maintenance.
2Reliability
If advanced cooling systems are used to prevent operational failures, then device reliability improves, but the ease of operation decreases
Solution Approach 1:
The cooling system is designed to circulate cooling fluids through the heat exchanger vessels automatically during device operation. The system self-regulates temperature by continuously exchanging heat between the primary and secondary cooling circuits, eliminating the need for complex external temperature monitoring and manual intervention, thereby maintaining high reliability while preserving ease of operation.
3Duration of action of stationary object
If heat dissipation is enhanced to manage high heat generation, then device lifetime is extended, but the loss of energy increases
Solution Approach 1:
The cooling system utilizes phase change of the cooling fluids during heat exchange between the inner and outer vessels. The fluids absorb and release latent heat during phase transitions, enabling efficient heat dissipation that protects the device from thermal damage and extends its operational lifetime, while the phase change mechanism manages energy transfer more efficiently than sensible heat alone.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system provides a simple and reliable cooling solution, maintaining the electronic device at a suitable temperature, preventing damage and ensuring efficient operation by effectively dissipating heat generated during downhole operations, even in high-temperature environments.
Implementation Method 1
a first heat exchanger element internal to a heat exchanger vessel, and a second heat exchanger element associated with the electronic device, wherein the first and second heat exchanger elements are in fluid communication by a cooling fluid
Implementation Method 2
the heat exchanger vessel allows the circulation of a secondary cooling fluid
Data Source
AI summary
The present invention is related to cooling systems for electronic devices used in downhole operations. In this scenario, the present invention provides a downhole electronic device cooling system comprising a first heat exchanger element (1) internal to a heat exchanger vessel (3), and a second heat exchanger element (2) associated with the electronic device (4), wherein the first (1) and second (2) heat exchanger elements are in fluid communication by a cooling fluid, wherein the heat exchanger vessel (3) allows the circulation of a secondary cooling fluid.