Downhole Electronics Enclosure with Conductive Shells
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional packaging methods for downhole electronic modules in the oil and gas industry face challenges such as high shock and vibration, extreme temperatures, corrosive conditions, abrasive environments, space restrictions, and inefficient heat dissipation, leading to potential damage and increased failure rates during transport and field use.
Innovation Solution
The proposed solution involves an electronics enclosure system with semi-cylindrical shells made of thermally conductive materials, where circuit boards and components are mounted directly to the shells, and a thermally conductive elastomeric material and gel are used to enhance heat dissipation and protection, allowing for modular assembly and efficient heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If electronic modules are potted in foam or silicone substance, then protection from harsh downhole environmental conditions is improved, but manufacturing complexity and risk of component damage increase
Solution Approach 1:
The patent extracts the electronic module from the potting process entirely by providing it with its own integrated enclosure. The enclosure system includes an outer housing and inner housing that protect the circuit board without requiring foam or silicone potting, thereby eliminating the manufacturing complexity and component damage risks associated with potting while maintaining protection from harsh environments.
Solution Approach 2:
The patent divides the protective structure into multiple segments: an outer housing, an inner housing, and a circuit board mounted within the inner housing. This segmentation allows each component to be manufactured and assembled separately, avoiding the complexity of potting while providing comprehensive protection against downhole environmental conditions.
2Reliability
If electronic modules are wet mounted in downhole tools, then protection from harsh downhole environments is improved, but ease of repair deteriorates due to aggressive removal procedures
Solution Approach 1:
The patent segments the electronic module into a self-contained unit with outer housing, inner housing, and circuit board assembly. This modular design allows the entire enclosed module to be removed as a single unit from the downhole tool without aggressive procedures, significantly improving ease of repair while maintaining environmental protection through the sealed enclosure structure.
3Volume of moving object
If conventional packaging methods are used, then space restrictions are accommodated, but heat dissipation efficiency deteriorates
Solution Approach 1:
The patent extracts the heat dissipation function from the conventional potting material and implements it through dedicated thermal management structures including heat sinks and thermally conductive interfaces between the circuit board, inner housing, and outer housing. This extraction improves heat dissipation efficiency while maintaining compact dimensions suitable for space-restricted downhole environments.
Solution Approach 2:
The patent employs composite material structures with thermally conductive materials in the housing and thermal interfaces to enhance heat dissipation. The combination of metallic housings with thermal pathways and thermally conductive compounds creates an efficient thermal management system within the constrained volume of the downhole tool.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the risk of damage, improves heat dissipation, and allows for the use of higher-powered components, enhancing the reliability and efficiency of downhole electronic assemblies while simplifying assembly and reducing costs.
Implementation Method 1
a thermally conductive elastomeric material and gel are used to enhance heat dissipation
Data Source
AI summary
An electronics enclosure system includes a pressure housing with a thermally conductive material and a plurality of shells disposed within the pressure housing, wherein the plurality of shells are coupled together to form an enclosure, and wherein each shell of the plurality of shells comprises thermally conductive material. The electronics enclosure system further includes at least one circuit board secured to an inner surface of a respective shell of the plurality of shells and a plurality of electronic components secured to the at least one circuit board, the plurality of shells, or some combination thereof.