Downhole Electronics Enclosure With Phase-Change Vacuum Insulation
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Solution Overview
Problem
Consumer-grade electronics are unreliable at high temperatures and existing insulation tools for downhole applications are expensive, fragile, and limited in geometry, making them difficult to install and maintain, while specialized electronics are costly and hard to source.
Innovation Solution
A downhole electronics enclosure system with a tool body, removable carrier, phase change media, and support mechanism that creates a vacuum to minimize heat transfer, using end caps to suspend the carrier and reduce direct heat conduction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If specialized electronics are used for high temperature applications, then reliability at high temperature is improved, but cost and difficulty of sourcing increase
Solution Approach 1:
The patent introduces an intermediary thermal insulation system consisting of a carrier body with phase change material and a tool body with vacuum insulation. This intermediary structure protects consumer-grade electronics from high temperature exposure, allowing them to operate reliably in high temperature downhole environments without requiring expensive specialized high-temperature electronics.
Solution Approach 2:
The patent utilizes phase change material (paraffin wax) within the carrier body that absorbs heat during phase transition from solid to liquid. This phase transition mechanism actively manages thermal energy, maintaining a stable temperature environment for consumer-grade electronics and preventing them from reaching their temperature limits.
2Ease of manufacture
If consumer grade electronics are used in high temperature applications, then cost and availability are improved, but reliability deteriorates
Solution Approach 1:
The patent implements beforehand cushioning by pre-cooling the phase change material and creating a vacuum insulation environment before the electronics are exposed to high temperature downhole conditions. This preparatory thermal protection allows consumer-grade electronics to withstand high temperature exposure without failing, extending their operational reliability.
Solution Approach 2:
The dual-layer insulation system (phase change material in carrier body, vacuum in tool body) acts as an intermediary thermal barrier that decouples the consumer-grade electronics from the high temperature environment, allowing the electronics to operate within their temperature specifications while the insulation system handles the extreme external conditions.
3Temperature
If existing insulation tooling is used for downhole applications, then thermal insulation is improved, but device complexity and fragility increase
Solution Approach 1:
The patent segments the insulation system into two independent functional components: a carrier body containing phase change material that houses the electronics, and a tool body providing vacuum insulation. This segmentation allows each component to be optimized independently and simplifies assembly and maintenance compared to monolithic insulation systems.
Solution Approach 2:
The patent changes the physical state parameters of the insulation media - using phase change material in solid/liquid transition and vacuum (absence of gas). These parameter changes create highly effective thermal insulation with simpler structural requirements compared to traditional solid insulation materials, reducing device complexity while improving thermal performance.
4Temperature
If existing insulation tooling is used for downhole applications, then thermal insulation is improved, but ease of operation deteriorates
Solution Approach 1:
The segmented design with a removable carrier body that fits within the tool body enables easy installation and removal of electronics. The carrier can be independently assembled, filled with phase change material, and installed into the vacuum-insulated tool body without complex assembly procedures, significantly improving ease of operation.
Solution Approach 2:
The carrier body is designed to nest within the tool body, with the carrier fitting into the vacuum-sealed interior of the tool. This nesting arrangement allows for compact packaging during installation and easy removal of the carrier for maintenance or electronics replacement, enhancing operational ease.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the use of consumer-grade electronics in downhole environments by providing effective thermal insulation, extending operating time, and allowing for a wider range of components, while reducing costs and simplifying installation and maintenance.
Implementation Method 1
A downhole electronics enclosure system includes a tool body defining an interior cavity, a carrier body removably provided within the interior cavity, a phase change media, and a support mechanism
Implementation Method 2
A phase change media and support mechanism are also provided
Implementation Method 3
A method is provided. The method includes providing electronics within an interior compartment of a carrier body, sealing a phase change media within the interior compartment via at least one end cap
Implementation Method 4
Systems for thermally insulating sensitive downhole equipment
Implementation Method 5
The upper end cap and the lower end cap each include a shaft, a plurality of spokes extending from a first end of the shaft, and a base extending from a second end of the shaft. The base is disposed within either the open top end or the open bottom end of the carrier body, and the plurality of spokes radially extend from the shaft for suspending the carrier body such that heat is conducted to the carrier body through the plurality of spokes, the shaft, and the base.
Data Source
AI summary
A downhole electronics enclosure system may include a tool body, a carrier body, a phase change media, and a support mechanism. The tool body defines an interior cavity. The carrier body may be removably provided within the interior cavity, and the carrier body may define an interior compartment for receiving electronics. The phase change media may be sealed within the interior compartment of the carrier body. The support mechanism may suspend the carrier body within the interior cavity of the tool body, such that a space is defined between an outer surface of the carrier body and an inner surface of the tool body.