Downhole Electronics Packaging with Shock Absorber

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Downhole electrical circuitry in boreholes is prone to damage from mechanical shock, vibration, and heat buildup, which existing technologies fail to adequately protect, leading to potential failure of electrical devices in extreme environments.

Innovation Solution

A downhole device with a recessed cavity containing a shock-absorber and vibration-damping layer to secure and stabilize an electrical module, preventing movement and dissipating heat, thus protecting the circuitry from mechanical stress and thermal issues.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If electrical circuitry is enclosed to protect from fluids, then protection from fluid damage is improved, but heat dissipation deteriorates due to heat buildup

Engineering Contradiction:
Improveprotection from fluid damageVSAvoidheat dissipation
Core Design Contradiction:
ReliabilityVSTemperature

Solution Approach 1:

The patent employs a sealed enclosure with integrated heat dissipation features, where the cover and base form a fluid-tight seal while incorporating thermal management mechanisms to conduct heat away from the electrical circuitry, resolving the contradiction between fluid protection and heat dissipation

Inventive Principle:
Principle #30Flexible shells and thin films

2Reliability

If electrical circuitry is enclosed in a sealed cavity, then protection from mechanical shock and vibration is improved, but heat dissipation deteriorates due to insufficient heat sinking

Engineering Contradiction:
Improveprotection from mechanical shockVSAvoidheat dissipation
Core Design Contradiction:
ReliabilityVSTemperature

Solution Approach 1:

The sealed cavity design incorporates thermal pathways through the enclosure structure, allowing heat to conduct from the electrical circuitry through the sealed walls to external heat sinks, maintaining both protection and thermal management

Inventive Principle:
Principle #30Flexible shells and thin films

3Reliability

If electrical module is secured with shock-absorber, then protection from mechanical shock is improved, but device complexity increases

Engineering Contradiction:
Improveprotection from mechanical shockVSAvoidstructure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent integrates shock-absorbing elements directly into the enclosure structure, such as compliant mounting features or dampening materials incorporated into the base or cover, providing shock protection while minimizing additional components and structural complexity

Inventive Principle:
Principle #30Flexible shells and thin films

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively absorbs shock and vibration, maintaining the electrical module's stability and facilitating heat dissipation, thereby enhancing the reliability and longevity of downhole electrical equipment in harsh drilling and well completion operations.

Implementation Method 1

a shock-absorber configured to support an electrical module within the first cavity, the shock-absorber disposed between a base of the first cavity and the cover opposite the base

Methodology Applied
Scientific EffectShock absorption: Damping

Implementation Method 2

a vibration-damping layer disposed between the base of the first cavity and the cover, the vibration-damping layer configured to dampen vibration of the electrical module

Methodology Applied
Scientific EffectVibration damping: Damping

Implementation Method 3

the electrical circuitry generates heat, and in downhole environments where electrical circuitry must be enclosed to protect the circuitry from fluids in the borehole, the heat may build up without sufficient sinking

Methodology Applied
Scientific EffectHeat dissipation: Convection

Data Source

PatentUS11143017B2Packaging for electronics in downhole assemblies
Publication Date: 2021.10.12 BAKER HUGHES CO
  • US11143017B2 patent drawing
  • US11143017B2 patent drawing
  • US11143017B2 patent drawing

AI summary

A downhole device configured to be inserted into a borehole includes a device body having an outer surface and a recess formed in the outer surface, a cover covering the recess to form a first cavity, and a shock-absorber configured to support an electrical module within the first cavity, the shock-absorber disposed between a base of the first cavity and the cover opposite the base. The downhole device also includes a vibration-damping layer disposed between the base of the first cavity and the cover, the vibration-damping layer configured to dampen vibration of the electrical module.