Interfacial Materials for Downhole Structures

Solution Overview

Problem

Downhole structures and tools face rapid degradation due to aggressive environments in wellbores, including abrasive surfaces, corrosive chemicals, and high temperatures and pressures, leading to operational inefficiencies and high repair and replacement costs.

Innovation Solution

The use of self-reinforced polyphenylene, polyphenylene sulfide, polysulfone, and polyphenylsulfone as interfacial materials between substrates in downhole structures, providing enhanced mechanical strength, adhesion, wear resistance, thermal resistance, and chemical resistance to withstand extreme downhole conditions.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional interfacial materials are used in downhole structures, then initial adhesion and structural integrity are achieved, but rapid degradation occurs due to abrasive surfaces, corrosive chemicals, and high temperatures and pressures

Engineering Contradiction:

Improvedurability of interfacial materialVSAvoiddegradation from aggressive environment

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent employs composite interfacial materials comprising polymer matrices (such as polyethylene, polypropylene, polyester, nylon, PVC, or elastomers) combined with particulate fillers (such as glass beads, glass flakes, metal particles, or ceramic particles). This composite structure provides both the adhesion properties needed for initial bonding and the enhanced resistance to degradation from abrasive surfaces, corrosive chemicals, and extreme temperatures and pressures. The particulate fillers specifically contribute to wear resistance and structural stability in the aggressive downhole environment.

Inventive Principle:

Principle #40Composite materials

2Strength

If standard adhesives are used to bond substrates in downhole applications, then initial bonding is achieved, but adhesion strength deteriorates rapidly under extreme conditions

Engineering Contradiction:

Improveadhesion strengthVSAvoidhigh temperature resistance

Core Design Contradiction:

StrengthVSTemperature

Solution Approach 1:

The patent modifies the properties of interfacial materials by changing their chemical composition and physical structure. Specifically, it uses polymers with high glass transition temperatures (such as polyethylene, polypropylene, polyester, nylon, PVC, and elastomers) that maintain adhesion strength at elevated downhole temperatures. The addition of particulate fillers further modifies the material parameters to enhance thermal stability and resistance to degradation under extreme temperature and pressure conditions.

Inventive Principle:

Principle #35Parameter changes

3Duration of action of stationary object

If traditional interfacial materials are used, then initial structural assembly is achieved, but wear resistance is insufficient leading to frequent repairs and replacements

Engineering Contradiction:

Improveservice life of downhole structureVSAvoidmaterial degradation and wear

Core Design Contradiction:

Duration of action of stationary objectVSLoss of substance

Solution Approach 1:

The patent employs composite interfacial materials comprising polymer matrices (such as polyethylene, polypropylene, polyester, nylon, PVC, or elastomers) combined with particulate fillers (such as glass beads, glass flakes, metal particles, or ceramic particles). This composite structure provides both the adhesion properties needed for initial bonding and the enhanced resistance to degradation from abrasive surfaces, corrosive chemicals, and extreme temperatures and pressures. The particulate fillers specifically contribute to wear resistance and structural stability in the aggressive downhole environment.

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The patent applies protective interfacial materials with enhanced durability properties before the downhole structure is exposed to the aggressive environment. These pre-applied materials serve as a protective barrier that cushions against subsequent wear, corrosion, and thermal degradation, preventing direct damage to the substrate structures and reducing the frequency of repairs and replacements.

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

Data Source

PatentUS10940673B2Methods of forming structures for downhole applications

Publication Date: 2021.03.09 BAKER HUGHES CO

AI summary

A method of forming a structure for a downhole application comprises forming an interfacial material comprising at least one of self-reinforced polyphenylene, polyphenylene sulfide, polysulfone, and polyphenylsulfone between opposing surfaces of a first substrate and a second substrate. A downhole structure and a downhole assembly are also described.