Downhole Pod Housing with Matching Thermal Expansion Frame

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Solution Overview

Problem

Downhole drilling tools face challenges with mechanical rigidity and thermal expansion due to harsh conditions, including high vibrations and extreme temperatures, which can damage electronic components and affect drilling efficiency.

Innovation Solution

A downhole tool design featuring a substantially cylindrical pod with rigid outer surfaces and a central frame, made from materials with matching thermal expansion coefficients, coupled with shock absorbers to alleviate bending forces and protect electronic components, such as ceramic circuit boards, within a pressure barrel.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If rigid outer surfaces and central frame are used to enhance mechanical rigidity, then structural strength is improved, but thermal expansion mismatch can cause damage to electronic components

Engineering Contradiction:

Improvemechanical rigidityVSAvoidthermal stability

Core Design Contradiction:

StrengthVSReliability

Solution Approach 1:

The patent applies parameter changes by carefully selecting materials with matching thermal expansion coefficients. The frame is made from a material having a coefficient of thermal expansion substantially the same as that of the electronic component, eliminating thermal stress during temperature variations while maintaining mechanical rigidity through the rigid frame structure.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent uses composite material selection where the frame material is specifically chosen to match the thermal properties of the electronic component. This composite approach combines the structural advantages of rigid framing with thermal compatibility, resolving the contradiction between mechanical strength and thermal stability.

Inventive Principle:

Principle #40Composite materials

2Reliability

If shock absorbers are added to alleviate bending forces, then protection of electronic components is improved, but device complexity increases

Engineering Contradiction:

Improveprotection from vibrationsVSAvoidstructural complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent applies beforehand cushioning by incorporating shock absorbers that pre-position the electronic component to isolate it from vibrational forces. The shock absorbers are installed in advance to catch and dampen bending forces before they reach the electronic component, providing proactive protection rather than reactive measures.

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

3Stress or pressure

If transverse travel is allowed to alleviate bending forces, then stress reduction is improved, but positional stability deteriorates

Engineering Contradiction:

Improvebending forceVSAvoidpositional stability

Core Design Contradiction:

Stress or pressureVSStability of the object's composition

Solution Approach 1:

The patent applies dynamics by allowing controlled transverse travel of the electronic component within the pod. This dynamic capability enables the component to move slightly to accommodate bending forces and thermal expansion, reducing stress while maintaining overall positional stability through the constrained travel range provided by the pod structure.

Inventive Principle:

Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design enhances mechanical rigidity and thermal stability, reducing the risk of damage from vibrations and extreme temperatures, thereby improving the reliability and performance of downhole drilling operations.

Implementation Method 1

The frame may comprise a material having a coefficient of thermal expansion substantially the same as a second coefficient of thermal expansion of at least one material of the at least one electronic component

Methodology Applied

Scientific EffectThermal expansion: Thermal Expansion

Implementation Method 2

The apparatus may include shock absorbers coupling the pressure barrel and the pod

Methodology Applied

Scientific EffectShock absorption: Damping

Data Source

PatentUS11692431B2Electronic module housing for downhole use

Publication Date: 2023.07.04 BAKER HUGHES OILFIELD OPERATIONS LLC

AI summary

Methods, systems, devices, and products for downhole operations. Embodiments include downhole tools comprising an outer member configured for conveyance in the borehole; a pressure barrel positioned inside the outer member; a substantially cylindrical pod positioned inside the pressure barrel; and at least one downhole electronic component mounted between the exterior surface and the frame. The pod comprises at least one rigid outer surface forming an exterior surface of the pod and supported by a central frame extending across a diameter of the pod, such as a plurality of outer rigid surfaces. The pod may include a plurality of coupled rigid elongated semicircular metallic shells, wherein each shell of the plurality comprises a rigid outer surface of the plurality of outer rigid surfaces. Each of the at least one downhole electronic component may be sealingly enclosed within a corresponding shell.