Downhole Pressure Sensor Array With Quartz Resonators and Isolated Wiring
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Solution Overview
Problem
Conventional sensor arrays for measuring pressure and temperature in downhole environments face challenges such as fragility of optical fibers, failure under bending, shock, and vibration, as well as difficulties in routing electrical conductors through robust housings that withstand extreme pressures and temperatures.
Innovation Solution
A distributed pressure sensor array with sensor housings, cable segments, and electrical conductors that utilize quartz resonator pressure sensors and incompressible fluids, along with diaphragms and bulkheads to isolate components, allowing for robust connections and data transmission through metal jackets and insulation-free welding processes to prevent damage from high temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If optical fibers are used as temperature and/or pressure sensors, then continuous temperature and/or pressure profile can be obtained, but the fibers are fragile and prone to failure under shock and vibration
Solution Approach 1:
The patent replaces the optical fiber-based sensing system with an electrical conductor-based system. Electrical conductors are used to transmit signals from electronic pressure and temperature sensors, substituting the mechanical/optical fiber system with an electrical system that is more resistant to shock and vibration while maintaining the capability to provide continuous environmental profiles.
Solution Approach 2:
The patent uses electrical conductors as a substitute medium to perform the same function as optical fibers. Instead of using light transmission through fragile optical fibers, the system uses electrical signal transmission through more robust conductors to achieve the same goal of transmitting sensor data from distributed measurement points.
2Strength
If welding is used to provide robust connection between components, then strong bonding is achieved, but sensitive components are exposed to excessive heat
Solution Approach 1:
The patent extracts the harmful heat generation step from the bonding process by replacing welding with mechanical bonding methods. Sensitive components are isolated from the bonding zone, and mechanical bonding techniques are used to achieve strong connections without subjecting electronic components to excessive heat exposure.
Solution Approach 2:
The patent introduces mechanical bonding as an intermediary method to achieve component connection. Instead of directly applying heat through welding, mechanical bonding serves as an alternative mechanism that provides robust connections while protecting sensitive components from thermal damage.
3Loss of information
If electrical conductors are passed through robust housings to connect sensors, then data transmission is enabled, but routing becomes difficult due to housing design for pressure resistance
Solution Approach 1:
The patent segments the housing structure to include dedicated conductor passage features. The housing is divided into sections with specific pathways designed for electrical conductor routing, allowing data transmission while maintaining the structural integrity needed for pressure resistance. This segmentation simplifies the routing process compared to trying to pass conductors through solid, unsegmented robust housings.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a robust and reliable system for measuring pressure and temperature in extreme downhole conditions, ensuring accurate data transmission and withstanding high pressures and temperatures while minimizing component damage and contamination.
Implementation Method 1
at least one quartz resonator pressure sensor disposed in a pressure housing for detecting a pressure of an environment external to the sensor housing
Implementation Method 2
at least one chamber in the sensor housing holding a substantially incompressible fluid and in communication with the at least one pressure sensor
Data Source
AI summary
Downhole distributed pressure sensor arrays include sensor housings each comprising at least one pressure sensor in a pressure housing. Downhole pressure sensors include a housing, at least one pressure sensor in a pressure housing portion of the housing, and at least one isolation element positioned at an outer wall of the housing.