Downlight Apparatus Using DOB Technology for Cost and Heat Management

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Solution Overview

Problem

Current LED lighting devices face challenges in reducing production costs and improving heat dissipation, leading to shorter lifespan and higher costs due to expensive LED light bar materials and inefficient heat management.

Innovation Solution

The implementation of a Driver on Board (DOB) technology, where LED components and driver circuits are integrated on a circuit base board, along with an electrical connector module featuring a standard interface structure, to reduce system costs and enhance heat dissipation through various connecting methods and metal conductors, allowing for efficient electrical connections and heat management.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Illumination intensity

If LED light bar materials are used to improve light efficiency, then illumination intensity is improved, but manufacturing cost increases

Engineering Contradiction:
Improvelight efficiencyVSAvoidmanufacturing cost
Core Design Contradiction:
Illumination intensityVSEase of manufacture

Solution Approach 1:

The patent divides the lighting system into separate modules: LED light bar module and driver circuit module. This segmentation allows independent optimization of each module, enabling the use of cost-effective LED materials while maintaining overall system performance and reducing total manufacturing cost.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent transitions from integrating everything on a single PCB to a three-dimensional modular architecture where LED bars are mounted separately from driver circuits. This dimensional change enables better heat dissipation paths and reduces material costs by using simpler, more efficient structures.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Device complexity

If traditional integrated PCB design is used to simplify structure, then device complexity is reduced, but heat dissipation capability deteriorates

Engineering Contradiction:
Improvestructure integrationVSAvoidheat dissipation capability
Core Design Contradiction:
Device complexityVSTemperature

Solution Approach 1:

The patent segments the integrated PCB design into separate LED modules and driver circuit modules. This physical separation creates independent heat dissipation zones, allowing heat to be managed more effectively without requiring complex integrated thermal management systems.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent introduces heat dissipation fins and thermal management structures as intermediary elements between the LED light bars and the environment. These intermediaries facilitate efficient heat transfer without complicating the overall device structure, maintaining simplicity while improving thermal performance.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Device complexity

If LED components and driver circuits are integrated on the same board, then device complexity is reduced, but heat dissipation becomes more difficult

Engineering Contradiction:
Improvecircuit integrationVSAvoidheat dissipation difficulty
Core Design Contradiction:
Device complexityVSTemperature

Solution Approach 1:

The patent divides the circuit system into distinct segments: LED driver circuit board and LED light bar assembly. This segmentation allows the driver circuits to be mounted on a separate board from the LED components, creating physical separation for heat management while maintaining electrical connectivity through standardized interfaces.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent moves from two-dimensional planar integration on a single board to three-dimensional spatial arrangement with vertical separation between driver circuits and LED components. This dimensional transition enables heat to dissipate in multiple directions without interfering with electrical connections, solving both integration and thermal management requirements.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

DOB technology effectively reduces overall costs, improves light efficiency, and extends the lifespan of LED lights by integrating driver circuits and LED components on a single board, while providing flexibility and stability in electrical connections, particularly with standard interfaces like IDEAL, facilitating easier market adoption and future intelligent lighting applications.

Implementation Method 1

an electrical connector module, wherein the electrical connector module has a standard interface structure and an input terminal structure

Methodology Applied
Scientific EffectElectrical conduction: Conduction (electrical)

Data Source

PatentUS11029009B2Downlight apparatus
Publication Date: 2021.06.08 XIAMEN ECO LIGHTING CO LTD
  • US11029009B2 patent drawing
  • US11029009B2 patent drawing
  • US11029009B2 patent drawing

AI summary

A lighting device includes a plurality of light source circuit components, a circuit base board and an electrical connector module. Said circuit base board is used for carrying said plurality of light source circuit components. The plurality of light source circuit components are electrically connected to each other through the connecting wire of the circuit base board. The electrical connector module has a standard interface structure and an input terminal structure. Said input terminal structure has a plastic housing and a metal conductor. Said metal conductor is electrically connected to the connecting wires of said circuit base board. The standard interface structure has a standard interface and is connected to the external interface of the corresponding external conductor through a pluggable method.