DPSS Laser Scanning System for Multi-Angle Release
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Solution Overview
Problem
The existing methods for laser release of flexible product layers from rigid carrier layers are costly and unreliable due to the use of expensive UV excimer lasers, and impurities or defects on the carrier layer can lead to incomplete release and damage to the product layer.
Innovation Solution
A laser scanning system that uses a diode-pumped solid state (DPSS) laser module operating in the UV band, with a scanning module and redirecting elements to irradiate the substrate from multiple directions, minimizing the impact of impurities and defects, and a beam homogenizer for uniform radiation dosage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If UV excimer lasers are used for laser release, then the release processing can be performed, but the cost is high
Solution Approach 1:
The patent changes the laser parameters by using DPSS laser instead of UV excimer laser, operating at different wavelength (355nm or 266nm) and pulse duration (nanosecond or picosecond), achieving effective laser release at lower cost
Solution Approach 2:
The patent replaces expensive UV excimer laser with cheaper DPSS laser system, reducing equipment purchase and operational costs while maintaining release functionality
2Productivity
If laser is applied through the carrier layer, then the release layer can be irradiated, but impurities or defects on the carrier layer cause shadowing and prevent proper irradiation
Solution Approach 1:
The patent introduces a second laser beam from a different spatial dimension (different incident angle) to irradiate the release layer, allowing laser energy to reach shadowed regions that were blocked by impurities or defects in the first beam path
Solution Approach 2:
The patent divides the laser irradiation into multiple segments (first laser beam and second laser beam from different directions), ensuring comprehensive coverage of the release layer even when some paths are blocked
3Reliability
If multiple laser systems are used to irradiate from different directions, then shadowing can be avoided, but the system complexity increases
Solution Approach 1:
The patent merges two laser beams into a single optical path using beam combining optics, allowing both beams to be delivered through one objective lens, thereby reducing system complexity while maintaining the benefit of multi-directional irradiation
Solution Approach 2:
The patent uses an intermediary optical system (beam combining optics and dichroic mirrors) to merge multiple laser beams, simplifying the overall system architecture by reducing the number of separate optical paths and components
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system achieves efficient and reliable laser release processing at lower costs, with reduced mechanical complexity, and effectively addresses shadowing effects from impurities or defects, ensuring complete release of the product layer without damaging it.
Implementation Method 1
A laser scanning system for scanning a laser beam over a substrate, particularly for the purposes of performing laser release of a flexible product layer from a rigid carrier layer
Implementation Method 2
The laser release layer may comprise a layer of polyimide... After processing, the product layer can be released from the carrier layer by suitable irradiation of the laser release layer
Implementation Method 3
the scanning module is used selectively to direct the laser beam to one of two different redirecting elements in order to achieve the different directions of incidence
Implementation Method 4
the cross-section of the laser beam is homogenised to create a uniform radiation dosage across the substrate
Implementation Method 5
the laser source comprises a diode-pumped solid state (DPSS) laser module, preferably operating in the UV band
Data Source
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AI summary
The invention relates to a laser scanning system and associated method. In a disclosed arrangement the method comprises using a laser source to produce a laser beam; using a scanning module to scan the laser beam over the surface of a substrate; and using a redirecting unit at a position in a beam path of the laser beam between the scanning module and the substrate to control the direction of incidence of the laser beam onto the substrate, wherein: the laser beam is scanned over a predetermined region on the substrate in such a way that each portion of the region is exposed by the laser beam from a plurality of different directions of incidence.