DRAM Defect Map Storage in Non-Volatile Memory
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing DRAM components face inefficiencies due to manufacturing defects and deterioration, leading to the need for redundant rows and columns to correct defective cells, which increases costs and reduces memory size, and often result in scrapping of components even when most of the DRAM is functional.
Innovation Solution
Incorporating non-volatile memory within the DRAM component to store references to defective volatile memory cells during manufacturing, allowing for their identification and mapping out of usable memory space, thereby reducing the need for redundant cells and increasing storage capacity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If redundant rows and columns are added to correct defective cells, then reliability is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent extracts the defect map storage function from the volatile memory array and places it in a separate non-volatile memory region. This separation allows the defect correction mechanism to operate independently without adding redundant rows and columns to the main memory array, thereby maintaining reliability while reducing device complexity.
Solution Approach 2:
The patent performs defect identification and creates a defect map during the manufacturing process before the DRAM is deployed. By pre-identifying defective cells and storing their locations in non-volatile memory, the system eliminates the need for complex runtime defect correction circuitry, as the defect information is already available for bypass operations.
2Reliability
If redundant rows and columns are added to correct defective cells, then reliability is improved, but manufacturing cost increases
Solution Approach 1:
The patent extracts the defect map storage function from the volatile memory array and places it in a separate non-volatile memory region. This separation allows the defect correction mechanism to operate independently without adding redundant rows and columns to the main memory array, thereby maintaining reliability while reducing device complexity.
Solution Approach 2:
The patent performs defect identification and creates a defect map during the manufacturing process before the DRAM is deployed. By pre-identifying defective cells and storing their locations in non-volatile memory, the system eliminates the need for complex runtime defect correction circuitry, as the defect information is already available for bypass operations.
3Reliability
If redundant rows and columns are added to correct defective cells, then defect coverage is improved, but available memory size decreases
Solution Approach 1:
The patent extracts the defect map storage function from the volatile memory array and places it in a separate non-volatile memory region. This separation allows the defect correction mechanism to operate independently without adding redundant rows and columns to the main memory array, thereby maintaining reliability while reducing device complexity.
Solution Approach 2:
The patent performs defect identification and creates a defect map during the manufacturing process before the DRAM is deployed. By pre-identifying defective cells and storing their locations in non-volatile memory, the system eliminates the need for complex runtime defect correction circuitry, as the defect information is already available for bypass operations.
4Reliability
If the number of defective cells exceeds redundant cells available, then defect correction capability is limited, but scrapping is avoided
Solution Approach 1:
The patent introduces a defect map as an intermediary data structure that stores the locations of all defective cells. This defect map acts as a mediator between the volatile memory array and the control logic, enabling the system to handle any number of defective cells by providing a comprehensive lookup table for bypass operations, thus eliminating the limitation imposed by the number of redundant cells.
Solution Approach 2:
The patent performs defect identification and creates a defect map during the manufacturing process before the DRAM is deployed. By pre-identifying defective cells and storing their locations in non-volatile memory, the system eliminates the need for complex runtime defect correction circuitry, as the defect information is already available for bypass operations.
Data Source
AI summary
In accordance with the present disclosure, a dynamic random access memory (DRAM) component is described. The DRAM component may comprise an integrated circuit, with the integrated circuit including an array of volatile memory cells. A first volatile memory cells of the array of volatile memory cells may be defective. The integrated circuit may also include non-volatile memory, and the non-volatile memory may contain a reference to the first volatile memory cell.


