DRAM Image-to-Design Alignment With Robust Offset Clustering
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Solution Overview
Problem
Current patch-to-design alignment methods in semiconductor manufacturing are prone to inaccuracies due to a limited number of suitable alignment targets, leading to sensitive alignment results that can be compromised by individual target inaccuracies, especially in devices like DRAMs.
Innovation Solution
A system and method for determining an offset using multiple alignment methods to align images of alignment targets on a specimen, identifying instances with threshold-compliant differences, and calculating a robust runtime align-to-design offset for improved accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If current patch-to-design alignment methods are used with a limited number of alignment targets, then the alignment process can be completed, but the alignment accuracy deteriorates because individual target inaccuracies significantly impact the overall result
Solution Approach 1:
The patent segments the alignment target into multiple instances distributed across the specimen. Instead of relying on a single alignment target, the system identifies and uses multiple instances of alignment targets (e.g., multiple memory cell arrays or logic blocks) to perform alignment. This segmentation reduces the impact of individual target inaccuracies and provides redundant data for more reliable offset calculation.
Solution Approach 2:
The patent merges the alignment results from multiple alignment target instances by aggregating their individual offsets. The system calculates offsets for each instance and then combines them through clustering algorithms to determine a final, more accurate align-to-design offset. This merging process leverages the collective information from multiple targets to overcome the limitations of any single target.
2Measurement precision
If multiple alignment methods are used to determine offsets for multiple alignment target instances, then the alignment accuracy improves through error rejection, but the computational complexity and processing time increase
Solution Approach 1:
The patent performs preliminary actions by first identifying multiple alignment target instances and calculating their individual offsets using multiple alignment methods before final aggregation. The system pre-processes the data by computing offsets for each instance with different methods (e.g., cross-correlation, phase shift), then prepares the data for clustering and outlier rejection. This preliminary computation enables more accurate final offset determination while organizing the complex processing in manageable stages.
Solution Approach 2:
The patent implements feedback mechanisms through iterative offset refinement. The system calculates initial offsets, identifies outliers using statistical methods, rejects inaccurate offsets, and then re-calculates the final offset based on the remaining valid data. This feedback loop continues until convergence, ensuring high accuracy while systematically managing the computational complexity through structured iteration.
Data Source
AI summary
Methods and systems for alignment for semiconductor applications are provided. One method includes determining different align-to-design offsets for multiple instances of an alignment target formed on a specimen by separately aligning images of the multiple instances of the alignment target generated by an imaging subsystem to a rendered image for the alignment target with different alignment methods, respectively. The method also includes identifying the multiple instances having a difference between the different align-to-design offsets below a predetermined threshold. In addition, the method includes determining a runtime align-to-design offset for the alignment target from the different align-to-design offsets determined for only the identified multiple instances. That runtime align-to-design offset can then be used in a process performed on the specimen with an imaging subsystem.


