DRAM Module Thermal Management Using Fluorinated Ether Fluid
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Solution Overview
Problem
Existing dynamic random access memory (DRAM) modules face inefficiencies in heat dissipation due to limited thermal conductivity and multimedia interference, leading to suboptimal operating temperatures.
Innovation Solution
A DRAM module design incorporating a housing with a fluorine engineering fluid sealed in an accommodating space, thermally connected to the DRAM chip, which enhances heat transfer and maintains optimal operating temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If metals are used for heat dissipation by thermal conduction, then heat removal capability is improved, but the heat dissipation efficiency is limited by the heat conducting path and contacting area
Solution Approach 1:
The patent uses a thermal conducting fluid (fluorinated ether liquid) instead of solid metal thermal sheets to transfer heat. The liquid medium provides superior thermal conductivity and can flow to ensure complete contact with the heat-generating component, eliminating the limitations of fixed contacting area and heat conducting path resistance that plague solid metal heat sinks.
Solution Approach 2:
The invention employs a composite heat dissipation system combining a fluorinated ether liquid thermal conducting fluid with a housing structure. This composite approach leverages the high thermal conductivity and fluidity of the fluorinated ether liquid while utilizing the structural support of the housing, achieving both effective heat removal and efficient heat transfer without the limitations of single-material solutions.
2Temperature
If metal thermal sheets and thermal conducting fluids are used for indirect heat dissipation, then heat transfer is improved, but multi-media transferring along the thermal conduction path reduces efficiency
Solution Approach 1:
The patent extracts and eliminates the intermediate metal thermal sheet from the heat dissipation path. By using only the fluorinated ether liquid thermal conducting fluid in direct contact with both the heat-generating component and the housing, the system removes the multi-media transfer interface that causes efficiency losses, achieving direct liquid-to-structure heat transfer.
Solution Approach 2:
The fluorinated ether liquid serves as an optimized intermediary medium that provides superior thermal conductivity compared to traditional metal thermal sheets. This liquid mediator can adapt to surface irregularities and maintain complete thermal contact, eliminating the efficiency losses associated with multi-media transferring while still enabling effective indirect heat dissipation from the component to the housing.
3Temperature
If a fan is used for convection heat dissipation, then heat removal is attempted, but the effectiveness is not very good
Solution Approach 1:
The patent replaces the mechanical fan-based convection system with a passive thermal conduction system using fluorinated ether liquid. This substitution eliminates the need for moving parts and active cooling mechanisms, relying instead on the superior thermal conductivity of the liquid medium to naturally and efficiently transfer heat from the component to the housing through thermal conduction.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The fluorine engineering fluid effectively manages heat dissipation, ensuring the DRAM chip operates at an optimal temperature, improving efficiency and reducing thermal conductivity limitations.
Implementation Method 1
the fluorine engineering fluid is sealed in the accommodating space and thermally connected to the dynamic random access memory chip
Data Source
AI summary
The instant disclosure provides a dynamic random access memory (DRAM) module including a housing, a circuit board and a fluorine engineered fluid. The housing includes an accommodating space and an opening on a side thereof. The circuit board has at least a DRAM chip disposed thereon. The circuit board is received in the accommodating space and one end of the circuit board has at least a circuit contact protruding from the opening to the exterior of the housing. The fluorine electronic engineering fluid is sealed in the accommodating space and is thermally connected to at least one of the DRAM chip.