Drapable Flexible Circuit Mesh for Soft Goods Integration

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Solution Overview

Problem

Traditional methods of manufacturing electronic circuitry result in inflexible and non-drapable circuitry that cannot be satisfactorily integrated into soft goods such as textiles and upholstered products, lacking durability, adaptability, and ease of integration.

Innovation Solution

The development of drapable electronic circuitry layers through subtractive manufacturing methods, including mechanical and chemical processes, which involve removing portions of a conductive mesh to form circuitry traces, and then forming electrical connections and encasing with insulative layers.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If traditional methods of manufacturing electronic circuitry are used, then electrical functionality is achieved, but the circuitry becomes inflexible and non-drapable

Engineering Contradiction:
ImproveflexibilityVSAvoidmanufacturing complexity
Core Design Contradiction:
StrengthVSEase of manufacture

Solution Approach 1:

The circuitry is segmented into discrete conductive elements arranged in a mesh pattern rather than continuous traces, allowing the structure to flex and drape while maintaining electrical connectivity through the distributed network of conductive segments

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The circuitry is constructed using a flexible mesh structure with conductive material applied to a flexible substrate, enabling the circuitry to conform to curved surfaces and soft goods while maintaining electrical functionality

Inventive Principle:
Principle #30Flexible shells and thin films

2Reliability

If traditional circuitry manufacturing methods are used, then electrical connections are established, but the circuitry lacks durability and washability

Engineering Contradiction:
ImprovedurabilityVSAvoidintegration difficulty
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The conductive elements are integrated into the mesh structure itself rather than being separate components, creating a unified structure that combines mechanical durability with electrical functionality and enables washing without damage

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The circuitry uses composite construction combining flexible substrate material with conductive material applied in a mesh pattern, creating a durable integrated structure that maintains electrical properties while withstanding washing and mechanical stress

Inventive Principle:
Principle #40Composite materials

3Adaptability or versatility

If traditional circuitry is used, then electrical functionality is achieved, but the circuitry cannot be adapted to different soft good products

Engineering Contradiction:
ImproveadaptabilityVSAvoidcircuitry structure
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The mesh-based circuitry structure serves multiple functions simultaneously: it provides electrical connectivity, flexibility, drapability, and adaptability to various product shapes and sizes, making it universally applicable to different soft goods without requiring product-specific circuit designs

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The resulting flexible circuitry layers are capable of being integrated into a variety of soft goods, offering durability, adaptability, and ease of integration while maintaining electrical functionality, even when subjected to stretching or bending.

Implementation Method 1

applying a chemical to the mesh, wherein the chemical is configured to remove at least a portion of the conductive material not covered by the mask layer

Methodology Applied
Scientific EffectChemical etching: Ablation

Data Source

PatentUS20250048559A1Drapable, flexible circuitry layers and methods therefor
Publication Date: 2025.02.06 LOOMIA TECHNOLOGIES INC
  • US20250048559A1 patent drawing
  • US20250048559A1 patent drawing
  • US20250048559A1 patent drawing

AI summary

A mechanical subtractive method of manufacturing a flexible circuitry layer may include mechanically removing at least a portion of a conductive mesh, wherein, following the mechanical removal, a remaining portion of the conductive mesh forms at least a portion of a circuitry trace comprising an electrode; forming an electrical connection between the electrode and a terminal of an interfacing component, wherein the interfacing component comprises a connector; and encasing at least a portion of the circuit trace with an insulative layer.