Drill Rake Groove Grinding for Smooth Chip Discharge
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing drill designs face challenges in smoothly discharging chips without clogging, as the thermal energy from laser machining used to form guide grooves can reduce the drill's strength and lead to physical interference during processing.
Innovation Solution
A method involving a rotary whetstone to grind guide grooves on the rake surface of the drill, which are formed in a direction extending along the chip discharge flute, using a rotating body shape that projects radially outward to avoid interference and reduce strength loss, allowing for effective chip guidance and discharge.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If laser machining process is used to form guide grooves, then guide grooves can be formed on the rake surface, but thermal energy generated causes strength reduction of the drill
Solution Approach 1:
The patent replaces the laser machining process (thermal energy method) with a mechanical grinding process using a whetstone to form guide grooves on the rake surface. This substitution eliminates the thermal energy that causes strength reduction while achieving the same functional result of forming guide grooves for chip discharge.
2Ease of manufacture
If conventional machining process is used to form guide grooves, then guide grooves can be formed, but physical interference between the drill and processing tool occurs
Solution Approach 1:
The patent introduces a whetstone with a specific rotational configuration where the rotational axis intersects the rake surface at an angle. This dimensional arrangement allows the whetstone to access and form guide grooves in the complex three-dimensional rake surface geometry without physical interference with the drill body or chip discharge flutes.
3Productivity
If guide grooves are formed to discharge chips smoothly, then chip discharge is improved, but strength reduction occurs due to laser machining
Solution Approach 1:
The patent replaces laser machining with mechanical grinding using a whetstone to form guide grooves. This maintains the chip discharge efficiency function while eliminating the thermal damage that reduces drill strength, thereby achieving both high productivity and maintained strength.
4Ease of manufacture
If laser machining is used to form guide grooves, then guide grooves can be formed, but drill lifetime is reduced
Solution Approach 1:
The patent substitutes mechanical grinding with a whetstone for laser machining to form guide grooves. This eliminates thermal energy input that degrades the drill material, thereby preserving drill strength and extending drill lifetime while still achieving effective guide groove formation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables continuous chip discharge without clogging, enhances drill strength, and reduces processing time and cost by avoiding strength reduction and physical interference, improving processing efficiency.
Implementation Method 1
The groove formation step forms a ground groove on the rake surface by grinding the rake surface
Data Source
AI summary
A method of producing a drill has a step of preparing a workpiece to be processed to produce a drill, and a step of forming a ground groove. The workpiece has a cutting blade, a chip discharge flute helically extending, and a rake surface which have been formed therein. The drill is rotated around a drill axial center. The formation step rotates a rotary whetstone around its whetstone axial center, and grinds the rake surface to form the ground groove along the chip discharge flute. The formation step uses the rotary whetstone so that the whetstone axial center intersects a longitudinal direction of the chip discharge flute. The rotary whetstone has a rotating body shape projecting in a radial outward direction of the rotary whetstone axial center and around the rotary whetstone axial center.