Drive Backboard Single-Mask Patterning for Mini LED Cost Reduction
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Solution Overview
Problem
The manufacturing process of drive backboards for mini LEDs in direct-lit backlighting solutions is complex and costly due to the use of multiple masks, which increases production expenses.
Innovation Solution
A drive backboard design featuring a substrate with multiple conductive layers, insulating layers, and a conductive protective layer, where the pattern of the conductive protective layer is complementary to the insulating layer, allowing for the use of a single mask to pattern both layers, reducing manufacturing complexity and cost, and incorporating protective structures to prevent corrosion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If multiple masks are used to pattern different layers, then manufacturing precision is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent combines the patterning of the insulating layer and the conductive protective layer into a single mask process. The insulating layer and conductive protective layer are patterned simultaneously using one mask, eliminating the need for separate masking steps for each layer. This merging of processes reduces the number of masks from multiple to one, thereby reducing device complexity and manufacturing cost while maintaining patterning precision through the unified mask design.
2Manufacturing precision
If multiple masks are used to pattern different layers, then manufacturing precision is improved, but manufacturing cost increases
Solution Approach 1:
The patent merges the patterning operations of the insulating layer and conductive protective layer into a single mask process. By using one mask to define both layers simultaneously, the manufacturing cost is reduced compared to using separate masks for each layer. This consolidation maintains patterning precision while significantly lowering the overall manufacturing cost through reduced mask production and processing expenses.
3Ease of manufacture
If connecting lines are exposed without protection, then ease of manufacture is improved, but reliability decreases due to corrosion
Solution Approach 1:
The patent applies preliminary anti-action by providing a conductive protective layer that prevents corrosion of the connecting lines before the corrosion can occur. The protective layer is formed to cover and protect the connecting lines in advance, creating a protective barrier against environmental factors that could cause corrosion. This preventive measure ensures the reliability and longevity of the connecting lines without complicating the manufacturing process excessively.
Data Source
AI summary
A drive backboard includes: a first conductive layer including bonding pins and first connecting lines, an insulating layer including first via holes and second via holes, a second conductive layer including connecting electrodes and second connecting lines and a conductive protective layer including first protective structures and second protective structures. The first via hole exposes the bonding pin, one end of a first connecting line electrically connects a bonding pin, and the other end reaches the second via hole. One end of a second connecting line electrically connects a connecting electrode, and the other end electrically connects the first connecting line through the second via hole. The first protective structure covers the bonding pin, and the second protective structure covers the second connecting line formed at the position of the second via hole. The pattern of the conductive protective layer is complementary to the pattern of the insulating layer.