Drive Board Impedance Control via Widened Power Wiring
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Solution Overview
Problem
Current liquid jet recording devices face challenges in reducing manufacturing costs while enhancing liquid ejection performance, as existing configurations often require multiple wiring layers to achieve impedance control, leading to increased costs and complexity.
Innovation Solution
A drive board configuration with a double-layered structure, where the second power supply wiring line is wider than the differential line, functions as a plane to perform impedance control, reducing the need for additional ground wiring layers and allowing for a two-layer wiring structure, thereby lowering manufacturing costs and improving ink ejection performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple wiring layers are used to achieve impedance control, then signal transmission stability is improved, but manufacturing cost and device complexity increase
Solution Approach 1:
The patent combines the ground wiring line and power supply wiring line into a single second wiring layer, creating a composite structure that serves both grounding and power supply functions. This merging reduces the total number of wiring layers from three or more to just two layers, thereby simplifying the overall wiring structure while maintaining impedance control capability through the widened power supply wiring line configuration
Solution Approach 2:
The patent changes the width dimension of the power supply wiring line in the second wiring layer to be wider than the differential line in the first wiring layer. This dimensional change allows the power supply wiring line to function as an impedance control element, effectively replacing the need for additional dedicated ground layers and achieving impedance management through a two-layer structure
2Reliability
If multiple wiring layers are used to achieve impedance control, then liquid ejection performance is improved, but manufacturing cost increases
Solution Approach 1:
The patent merges the ground and power supply functions into a single second wiring layer, reducing the number of wiring layers from three or more to two. This simplification directly lowers manufacturing costs by reducing the complexity of the PCB fabrication process, while the widened power supply wiring line maintains the impedance control necessary for high-performance liquid ejection
Solution Approach 2:
The patent changes the width parameter of the power supply wiring line to be wider than the differential line, creating a specific geometric configuration that provides impedance control. This parameter change enables effective signal transmission for liquid ejection control without requiring additional wiring layers, thereby reducing manufacturing costs while maintaining ejection performance
Data Source
AI summary
There is provided a drive board a manufacturing cost of which can be reduced while enhancing a liquid ejection performance. The drive board according to an embodiment of the present disclosure is a drive board which is applied to a liquid jet head, and outputs a drive signal to a jet section, and includes a first wiring layer and a second wiring layer opposed to each other along a direction perpendicular to a board surface, at least one drive device which is mounted on the first wiring layer, and is configured to generate the drive signal, a first power supply wiring line which is arranged in the first wiring layer, and is a wiring line configured to supply drive power toward the drive device, a differential line which is arranged in the first wiring layer, and is a line configured to transmit a differential signal toward the drive device, and a second power supply wiring line which is arranged in the second wiring layer, which is electrically coupled to the first power supply wiring line via a first through hole, and is opposed to a first area in the differential line. A wiring width in the second power supply wiring line is larger than a line width of the first area in the differential line.