Drive Circuit Carrier Layout to Prevent Test Lead Overlap
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Solution Overview
Problem
As display panel resolution increases, the density of test leads on the driver circuit carrier also increases, leading to overlapping test leads after punching and cutting, which can result in short circuits and reduced yield.
Innovation Solution
A drive circuit carrier design featuring a flexible substrate with first and second test leads alternately staggered, where the first end of each first test lead is flush with the edge of the substrate, and the second end of each second test lead is inwardly retracted, preventing short circuits during punching and cutting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the density of test leads on the driver circuit carrier is increased to support higher display resolution, then the number of signals and functionality are improved, but the test leads are likely to overlap after punching and cutting, resulting in short circuits and reduced yield
Solution Approach 1:
The patent applies asymmetry by designing test leads with different lengths - first test leads extend to the first edge of the flexible substrate while second test leads are shorter and do not reach the first edge. This asymmetric arrangement ensures that after punching and cutting, the test leads do not overlap even when densely packed, preventing short circuits while maintaining high signal density for high-resolution displays
Solution Approach 2:
The patent resolves the overlap problem by transitioning from a two-dimensional planar arrangement where all test leads reach the same edge to a staggered arrangement where test leads are positioned at different distances from the edge. This creates a dimensional variation in the lead arrangement, effectively preventing overlap in the punched and cut configuration
2Quantity of substance
If test leads are arranged densely to support high resolution displays, then signal capacity is improved, but manufacturing precision is compromised due to overlapping leads after punching and cutting
Solution Approach 1:
By making test leads asymmetric in length - with first test leads reaching the first edge and second test leads being shorter - the patent ensures that even when punched and cut with high precision requirements, the leads maintain proper spacing and do not overlap, thereby preserving manufacturing precision while achieving high signal density
3Ease of manufacture
If all test leads are made flush with the edge of the substrate for uniformity, then ease of manufacture is improved, but the probability of short circuit increases due to overlapping after punching and cutting
Solution Approach 1:
The patent deliberately introduces asymmetry in test lead lengths, where first test leads are flush with the first edge while second test leads are shorter. This asymmetric design sacrifices the simplicity of uniform lead arrangement but effectively prevents overlapping and short circuits after punching and cutting, thereby improving reliability
Data Source
AI summary
A drive circuit carrier and a display device. The drive circuit carrier includes a flexible substrate; and first test leads and second test leads, alternately staggered on a first surface of the flexible substrate in sequence. A first end of each first test lead is flush with a first edge of the first surface, and a second end of each second test lead is away from the first edge relative to the first end.