Drive Chip Pin Layout to Prevent COG Bonding Seesaw
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Solution Overview
Problem
The existing drive chip design for chip-on-glass display panels results in a 'seesaw' effect when bonded to the display panel, causing some drive pins to lift up and fail to bond properly, leading to poor electrical conduction and decreased display panel performance.
Innovation Solution
The drive chip is designed with a first area having a lower pin density and a second area with a higher pin density, where the first drive pins are located further away from the substrate than the second drive pins, ensuring balanced support and preventing pin lift-up.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If drive pins are placed at one side of the drive chip to achieve narrow lower bezel, then the lower bezel width is reduced, but the drive pins become unbalanced and cause seesaw effect during bonding
Solution Approach 1:
The patent applies local quality by creating different pin densities in different areas of the drive chip. The first area has a first pin density while the second area has a second pin density that is different from the first. This non-uniform pin distribution compensates for the seesaw effect caused by placing all pins at one side, thereby maintaining bonding stability while achieving narrow lower bezel.
2Length of stationary object
If drive pins are placed at one side of the drive chip, then the lower bezel is narrowed, but electrical conduction becomes poor due to pin lift-up during bonding
Solution Approach 1:
The patent implements local quality by varying pin density across different regions of the drive chip. The first area contains pins at a first density while the second area contains pins at a second density. This localized variation ensures that pins remain properly positioned during bonding, preventing lift-up and maintaining reliable electrical conduction while still achieving the narrow lower bezel design.
3Ease of manufacture
If uniform pin density is used across the drive chip, then manufacturing is simplified, but bonding support becomes unbalanced causing seesaw effect
Solution Approach 1:
The patent resolves this contradiction by applying local quality - different pin densities are used in different areas of the drive chip. The first area has a first pin density and the second area has a second pin density. This non-uniform distribution provides balanced bonding support across the chip while still allowing for manufacturable designs, eliminating the seesaw effect that would occur with uniform pin distribution.
Data Source
AI summary
The present application discloses a drive chip and a display panel. The drive chip includes a first area and a second area. The drive chip includes a substrate and drive pins. The density of the pins located in the first area is lower than the density of the pins located in the second area. The pins located in the second area includes first drive pins and second drive pins. The distance between the substrate and a face of the first drive pins away from the substrate is greater than the distance between the substrate and a face of the second drive pins away from the substrate. The occurrence of poor electric conduction is avoided.