Drive Circuit Layout With Fan Cooling for Multi-Head Inkjet Stability
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Solution Overview
Problem
Existing liquid discharge apparatuses face challenges in efficiently cooling drive circuits while minimizing size and maintaining discharge stability, particularly when multiple heads are used, due to the heat generation and size constraints of the drive circuit substrate.
Innovation Solution
A drive circuit unit arrangement that includes a first connector, a drive circuit, a fan, and a conversion circuit, ordered as first connector, drive circuit, and fan, with a conversion circuit, to enhance cooling efficiency and reduce size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If forced air cooling is used to cool the drive circuit, then cooling efficiency is improved, but the size of the air cooling mechanism increases
Solution Approach 1:
The patent combines the drive circuit and the fan into a single integrated unit. The fan is mounted on the substrate that also carries the drive circuit, merging the cooling function with the existing circuit board structure. This integration eliminates the need for separate cooling mechanisms and reduces overall device volume while maintaining effective cooling of the heat-generating drive circuit components.
Solution Approach 2:
The patent positions the fan in close proximity to the drive circuit on the same substrate, utilizing the planar space efficiently. By arranging the fan adjacent to the heat-generating components on the substrate, the cooling air can directly reach the heat sources without requiring additional vertical or lateral space for separate cooling structures.
2Reliability
If the substrate is disposed directly above the head to suppress transmission line length increase, then discharge stability is improved, but the device complexity increases when multiple heads are used
Solution Approach 1:
The patent divides the liquid discharge apparatus into modular units, each containing a substrate with drive circuits positioned directly above individual heads. This segmentation allows each module to maintain short transmission lines for discharge stability while the overall system can accommodate multiple heads through modular expansion, reducing the complexity of managing substrate arrangements across multiple heads.
3Adaptability or versatility
If the substrate size increases to accommodate multiple heads, then versatility is improved, but the length of transmission lines increases
Solution Approach 1:
The patent implements modular architecture where each head has its own substrate mounted directly above it, creating independent control modules. This segmentation allows the system to achieve versatility by adding or removing modules while keeping each individual transmission line short, as each module is self-contained with the head it controls.
Solution Approach 2:
The patent utilizes the vertical dimension by positioning substrates directly above heads in the height direction rather than expanding horizontally. This vertical arrangement allows multiple heads to be accommodated without increasing the lateral footprint or transmission line lengths, as each substrate-head connection is achieved through vertical stacking with short connections.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed arrangement improves cooling efficiency and reduces the size of the drive circuit unit, maintaining discharge stability and versatility in liquid discharge apparatuses with multiple heads.
Implementation Method 1
a fan FN that generates wind for the drive circuit
Data Source
AI summary
Provided is a drive circuit unit generating a drive signal for driving a head, the drive circuit unit including: a first connector coupled to the head; a drive circuit generating the drive signal; a fan generating wind for the drive circuit; and a conversion circuit converting a control signal for controlling the head, in which the first connector, the drive circuit, the fan, and the conversion circuit are arranged in an order of the first connector, the drive circuit, the fan, and the conversion circuit.